BGA의 3D 형상 검사는 flip chip 불량검사에 중요한 이슈다. 특히 반도체 산업은 단위 면적 당 볼의 개수가 급격히 증가해서 flip chip 접합에 더 빠르고 더 정확한 solder bumps 검사가 필요하다. BGA 같이 아주 작은 반사물체에서 3D 형상 재건은 잘 구조화 되고 세련된 조명장치가 필요하다. 게다가 간단하고 빠른 영상처리에는 실제 표면의 광도계 ...
BGA의 3D 형상 검사는 flip chip 불량검사에 중요한 이슈다. 특히 반도체 산업은 단위 면적 당 볼의 개수가 급격히 증가해서 flip chip 접합에 더 빠르고 더 정확한 solder bumps 검사가 필요하다. BGA 같이 아주 작은 반사물체에서 3D 형상 재건은 잘 구조화 되고 세련된 조명장치가 필요하다. 게다가 간단하고 빠른 영상처리에는 실제 표면의 광도계 반사율 모델이 필요하다. 이 논문에서는 solder bumps 의 2D 및 3D 검사를 위한 새로운 광도계 방법을 제시한다. 5단계 링 라이트 조명장치는 아주 작은 표면을 표현하기 위해 특별히 설계되었고 실제 하이브리드 반사율 모델은 납땜 표면의 3D 정보를 알기 위해 고안되었다. 실험적 결과는 시간과 정확도 관점에서 산업적 적용에 유용한 방법임을 보여준다.
BGA의 3D 형상 검사는 flip chip 불량검사에 중요한 이슈다. 특히 반도체 산업은 단위 면적 당 볼의 개수가 급격히 증가해서 flip chip 접합에 더 빠르고 더 정확한 solder bumps 검사가 필요하다. BGA 같이 아주 작은 반사물체에서 3D 형상 재건은 잘 구조화 되고 세련된 조명장치가 필요하다. 게다가 간단하고 빠른 영상처리에는 실제 표면의 광도계 반사율 모델이 필요하다. 이 논문에서는 solder bumps 의 2D 및 3D 검사를 위한 새로운 광도계 방법을 제시한다. 5단계 링 라이트 조명장치는 아주 작은 표면을 표현하기 위해 특별히 설계되었고 실제 하이브리드 반사율 모델은 납땜 표면의 3D 정보를 알기 위해 고안되었다. 실험적 결과는 시간과 정확도 관점에서 산업적 적용에 유용한 방법임을 보여준다.
The project aims at the research of inspecting visually the micro size object in the two – dimensional (2D) and three – dimensional (3D) manner. It especially focuses on the object in range of under 100µm in size, whose surface reflectance is complex, such as the micro-solder bumps on a semiconducto...
The project aims at the research of inspecting visually the micro size object in the two – dimensional (2D) and three – dimensional (3D) manner. It especially focuses on the object in range of under 100µm in size, whose surface reflectance is complex, such as the micro-solder bumps on a semiconductor wafer. There has been the big and rapid development in the microsystems packaging technologies, flip – chip bonding, wafer – level packaging and surface mounted packaging, etc. It makes the size of the balls being tiny to some extend to 50µm, which has been exceeded the limit of human’s inspection ability. Furthermore, since the criteria for quality control in industrial has been tighten up, inspecting the 3D features such as volume and shape has been required instead of the previous well – known 2D inspection methods. Even though many 3D inspection methods have tackled this task, they are suffering from the several issues such as specular reflectance of the surface, the tiny size, irregular shapes and so on. For example, triangular method using commercial laser beam has a limitation of making the beam – width very thin to increase its resolution. In this research, a new photometric approach is proposed for inspecting accurately the 3D shape of the ball bumps. To improve the performance of the inspection task in accuracy and speed, a sophisticated and robust, ring- shaped illumination device is designed. The 3D recovery algorithm of restoring the shape of the solder bump is derived by using the hybrid reflection model. The simulation and experimental results show a good performance for industrial purpose. This writing includes the main outputs of the research as the followings: - The ring – shaped structured illumination device for the purpose of the 2D and 3D inspection. - The algorithm of deriving the surface normal from image shading and recovery 3D shape from the surface normal.
The project aims at the research of inspecting visually the micro size object in the two – dimensional (2D) and three – dimensional (3D) manner. It especially focuses on the object in range of under 100µm in size, whose surface reflectance is complex, such as the micro-solder bumps on a semiconductor wafer. There has been the big and rapid development in the microsystems packaging technologies, flip – chip bonding, wafer – level packaging and surface mounted packaging, etc. It makes the size of the balls being tiny to some extend to 50µm, which has been exceeded the limit of human’s inspection ability. Furthermore, since the criteria for quality control in industrial has been tighten up, inspecting the 3D features such as volume and shape has been required instead of the previous well – known 2D inspection methods. Even though many 3D inspection methods have tackled this task, they are suffering from the several issues such as specular reflectance of the surface, the tiny size, irregular shapes and so on. For example, triangular method using commercial laser beam has a limitation of making the beam – width very thin to increase its resolution. In this research, a new photometric approach is proposed for inspecting accurately the 3D shape of the ball bumps. To improve the performance of the inspection task in accuracy and speed, a sophisticated and robust, ring- shaped illumination device is designed. The 3D recovery algorithm of restoring the shape of the solder bump is derived by using the hybrid reflection model. The simulation and experimental results show a good performance for industrial purpose. This writing includes the main outputs of the research as the followings: - The ring – shaped structured illumination device for the purpose of the 2D and 3D inspection. - The algorithm of deriving the surface normal from image shading and recovery 3D shape from the surface normal.
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