최근 smart-phone, tablet, All-in-one PC등 필수 입력장치로 Touch Screen에 대한 연구가 활발히 진행되고 있다.특히 경량화와 bezel의 slim화, multi-touch에 대한 요구가 커지고 있다.Touch Screen은 동작 방식에 따라 4가지로 나뉘며,그 중에서도 정전용량 방식의 TSP는 ...
최근 smart-phone, tablet, All-in-one PC등 필수 입력장치로 Touch Screen에 대한 연구가 활발히 진행되고 있다.특히 경량화와 bezel의 slim화, multi-touch에 대한 요구가 커지고 있다.Touch Screen은 동작 방식에 따라 4가지로 나뉘며,그 중에서도 정전용량 방식의 TSP는 저항막 방식에 비해 우수한 내구성과 높은 투과율을 가질 뿐만 아니라 멀티터치가 가능하며 감도 또한 뛰어나 스마트폰을 시작으로 대면적으로 크게 발전하고 있다.그 중에서 Projected Capacitance 방식은 저항막 방식에 비해 높은 투과율과 우수한 내구성, multi-touch가 가능하므로 스마트폰을 시작으로 크게 발전하고 있다.본 논문에서는 Wet-etching 기법을 사용하여 Window- unified large-rea touch screen panel을 개발하였고 다양한 simulation을 통한 pattern design으로 mutual cap 값이 touch에 어떠한 영향을 미치는지 연구를 하였다. Roll-to-Roll IPVD 장비를 이용하여 ITO 전극 박막을 진공 증착 하고 Wet-etching 포토 공정을 통해 X,Y축 전극의 전극 패턴을 하였고 X축 전극과 Y축전극 교차부는 OPEN 되는 구조로 패턴을 형성하였다. 전극 교차부 에는 포토 공정으로 Insulator 형성 및 Metal bridge 전극을 형성하여 Touch Screen Panel 을 제조 하였다.IPVD 공정 장비를 이용하여 Touch Screen Panel 용 투명전극개발을 개발하였고 GLASS에 따른 ITO의 Transmittance(85%) 의 변화와 High temperature(200℃)를 가했을 때의 유리 내구성을 알아 보고 Insulator 의 material 인 SIOC(투과율:92%) 에 대한 특성을 연구하였으며 이에 따른 다양한 모양을 구현하였다. Metal material인 Cu를 통하여 다른 metal material 비교를 통해 접착력과 전기적 특성으로 연구하여 최적의 조건으로 bridge와 bezel에 적용시켰다. 마지막으로 ANSYS Q3D를 이이용하여 insulator 크기,개수, island type 과 window type의 비교를 통한 여러 가지 mutual cap값을 최적의 pattern design으로 시뮬레이션 해보았다.이러한 과정을 통해 wet-etching기법으로 제작한 large area touch screen panel은 linearity(0.86mm)와 accuracy(0.83mm) 평가에서 높은 터치 성능을 구현할 수 있었다(Spec 1mm이하).
최근 smart-phone, tablet, All-in-one PC등 필수 입력장치로 Touch Screen에 대한 연구가 활발히 진행되고 있다.특히 경량화와 bezel의 slim화, multi-touch에 대한 요구가 커지고 있다.Touch Screen은 동작 방식에 따라 4가지로 나뉘며,그 중에서도 정전용량 방식의 TSP는 저항막 방식에 비해 우수한 내구성과 높은 투과율을 가질 뿐만 아니라 멀티터치가 가능하며 감도 또한 뛰어나 스마트폰을 시작으로 대면적으로 크게 발전하고 있다.그 중에서 Projected Capacitance 방식은 저항막 방식에 비해 높은 투과율과 우수한 내구성, multi-touch가 가능하므로 스마트폰을 시작으로 크게 발전하고 있다.본 논문에서는 Wet-etching 기법을 사용하여 Window- unified large-rea touch screen panel을 개발하였고 다양한 simulation을 통한 pattern design으로 mutual cap 값이 touch에 어떠한 영향을 미치는지 연구를 하였다. Roll-to-Roll IPVD 장비를 이용하여 ITO 전극 박막을 진공 증착 하고 Wet-etching 포토 공정을 통해 X,Y축 전극의 전극 패턴을 하였고 X축 전극과 Y축전극 교차부는 OPEN 되는 구조로 패턴을 형성하였다. 전극 교차부 에는 포토 공정으로 Insulator 형성 및 Metal bridge 전극을 형성하여 Touch Screen Panel 을 제조 하였다.IPVD 공정 장비를 이용하여 Touch Screen Panel 용 투명전극개발을 개발하였고 GLASS에 따른 ITO의 Transmittance(85%) 의 변화와 High temperature(200℃)를 가했을 때의 유리 내구성을 알아 보고 Insulator 의 material 인 SIOC(투과율:92%) 에 대한 특성을 연구하였으며 이에 따른 다양한 모양을 구현하였다. Metal material인 Cu를 통하여 다른 metal material 비교를 통해 접착력과 전기적 특성으로 연구하여 최적의 조건으로 bridge와 bezel에 적용시켰다. 마지막으로 ANSYS Q3D를 이이용하여 insulator 크기,개수, island type 과 window type의 비교를 통한 여러 가지 mutual cap값을 최적의 pattern design으로 시뮬레이션 해보았다.이러한 과정을 통해 wet-etching기법으로 제작한 large area touch screen panel은 linearity(0.86mm)와 accuracy(0.83mm) 평가에서 높은 터치 성능을 구현할 수 있었다(Spec 1mm이하).
Recently, the researches about the touch screen as the necessary input device for smart-phones, tablets and all-in-one PC(Personal Computer)s have been actively carried out. In particular, there have been more demands for the light weight, the slim orientation of the bezel and the multi-touch functi...
Recently, the researches about the touch screen as the necessary input device for smart-phones, tablets and all-in-one PC(Personal Computer)s have been actively carried out. In particular, there have been more demands for the light weight, the slim orientation of the bezel and the multi-touch function. The touch screen can be divided into four types based on the operation methods. Among them, TSP(Touch Screen Panel) of the capacitive type shows an excellent level of durability and a high transmittance compared to the resistive type. Also, it provides multi-touch functions with a great level of sensitivity. As a result, it has been greatly developed for large-scaled devices such as smart-phones. Among them, the projected capacitance type shows an excellent level of durability, a high transmittance and possible multi-touch functions compared to the resistive type, being widely developed especially for smart-phones. In this paper, the window-unified large-area TSP was developed by using the wet-etching method and the influence of the mutual cap value on the touch was studied with the pattern design. By using the Roll-to-Roll IPVD(Ionized Physical Vapor Deposition) equipment, the ITO(Indium tin oxide) electrode thin film became subject to deposition evaporation. Also, through the wet etching photo-lithography process, the electrode patterns of the X-axis and the Y-axis were looked at. The cross-section of the X-axis electrode and the Y-axis electrode formed the pattern with an open structure. In the cross-section of electrodes, the insulator and the metal bridge electrode were formed with the photolithography in order to produce the touch screen panel. By using the IPVD process device, the clear electrode for the touch screen panel was developed. Also, the change of transmittance for ITO based on the glass and the level of durability for the glass in case of high temperature were studied(Transmittance:85%). The characteristics of SiOC the material of the insulator, were studied with various shapes materialized(Transmittance:92%). Also, through the comparison with the metal material of Cu with other metal materials, the adhesion and the electric characteristics were studied before realizing the metal bezel and the bridge(Thickness:110nm, Sheet resistance:2Ω/square). Finally, by using ANSYS Q3D the size of the insulator, the quantity, the island type and the window type were compared to one another before designing various pattern designs. Also, simulations were applied for mutual cap values. Such a process, the large-area touch screen panel made with the wet-etching method could realize excellent touch functions in terms of linearity(0.86mm) and accuracy(0.83mm;Spec<1mm).
Recently, the researches about the touch screen as the necessary input device for smart-phones, tablets and all-in-one PC(Personal Computer)s have been actively carried out. In particular, there have been more demands for the light weight, the slim orientation of the bezel and the multi-touch function. The touch screen can be divided into four types based on the operation methods. Among them, TSP(Touch Screen Panel) of the capacitive type shows an excellent level of durability and a high transmittance compared to the resistive type. Also, it provides multi-touch functions with a great level of sensitivity. As a result, it has been greatly developed for large-scaled devices such as smart-phones. Among them, the projected capacitance type shows an excellent level of durability, a high transmittance and possible multi-touch functions compared to the resistive type, being widely developed especially for smart-phones. In this paper, the window-unified large-area TSP was developed by using the wet-etching method and the influence of the mutual cap value on the touch was studied with the pattern design. By using the Roll-to-Roll IPVD(Ionized Physical Vapor Deposition) equipment, the ITO(Indium tin oxide) electrode thin film became subject to deposition evaporation. Also, through the wet etching photo-lithography process, the electrode patterns of the X-axis and the Y-axis were looked at. The cross-section of the X-axis electrode and the Y-axis electrode formed the pattern with an open structure. In the cross-section of electrodes, the insulator and the metal bridge electrode were formed with the photolithography in order to produce the touch screen panel. By using the IPVD process device, the clear electrode for the touch screen panel was developed. Also, the change of transmittance for ITO based on the glass and the level of durability for the glass in case of high temperature were studied(Transmittance:85%). The characteristics of SiOC the material of the insulator, were studied with various shapes materialized(Transmittance:92%). Also, through the comparison with the metal material of Cu with other metal materials, the adhesion and the electric characteristics were studied before realizing the metal bezel and the bridge(Thickness:110nm, Sheet resistance:2Ω/square). Finally, by using ANSYS Q3D the size of the insulator, the quantity, the island type and the window type were compared to one another before designing various pattern designs. Also, simulations were applied for mutual cap values. Such a process, the large-area touch screen panel made with the wet-etching method could realize excellent touch functions in terms of linearity(0.86mm) and accuracy(0.83mm;Spec<1mm).
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