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NTIS 바로가기KIEE international transactions on electrophysics and applications, v.5C no.4, 2005년, pp.176 - 179
Kim In-Sung (Electric & Magnetic Devices Research Group. Korea Electrotechnology Research Institute) , Song Jae-Sung (Electric &Magnetic Devices Research Group. korea Electrotechnology research Institute) , Min Bok-Ki (Electric & Magnetic Devices Research Group. Korea Electrotechnology Research Institute) , Lee Won-Jae (Electric & Magnetic Devices Research Group. Korea Electrotechnology Research Institute) , Muller Alexandru (Laboratory of Microsystem and Micromachined Microwave Components, IMT, Romania)
The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF s...
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Sonnet user's manual, 2003
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