최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Transactions on electrical and electronic materials, v.7 no.4, 2006년, pp.163 - 166
Lee, Sang-Ho (Division of Materials and Chemical Engineering, Hanyang University) , Kang, Young-Jae (Division of Materials and Chemical Engineering, Hanyang University) , Park, Jin-Goo (Division of Materials and Chemical Engineering, Hanyang University) , Kwon, Pan-Ki (CMP division, Doosan DND Co., Ltd.) , Kim, Chang-Il (CMP division, Doosan DND Co., Ltd.) , Oh, Chan-Kwon (CMP division, Doosan DND Co., Ltd.) , Kim, Soo-Myoung (CMP division, Doosan DND Co., Ltd.) , Jhon, Myung-S. (CMP division, Doosan DND Co., Ltd.) , Hur, Se-An (Cabot Microelectronics Korea) , Kim, Young-Jung (Cabot Microelectronics Korea) , Kim, Bong-Ho (Cabot Microelectronics Korea)
The dishing and the erosion were evaluated on the tungsten CMP process with conventional and new developed slurry. The tungsten thin film was polished by orbital polishing equipment. Commercial pattern wafer was used for the evaluation. Both slurries were pre tested on the oxide region on the wafer ...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
A. H. Liu, R. Solis, and J. Givens, 'Development of a robust $KIO_{3}$ tungsten CMP process', Mat. Res. Soc. Symp. Proc., Vol. 566, p. 83, 2000
C. Yu, T. Myers, C. Streinz, S. Grumbine, and G. Grover, 'Tungsten polishing on an orbital plaform using cabot semi-sperse W2000 slurry', PACRIM Chemical Mechanical Planarization Symposium, Seoul, Korea, p. 31, 1997
S. H. Li, H. Banvillet, C. Augagneur, B. Miller, M. P. N. Henaff, and K. Wooldridge, 'Evaluation of $H_{2}O_{2}$ , $KIO_{3}$ and $Fe(NO_{3})_{3}$ -based W CMP slurries for 8', 0.35 um CMOS Technology', CMP-MIC Conference, Santa Clara, CA, p. 165, 1998
F. Kaufman, D. B. Thompson, R. E. Boradie, M. A. Jaso, W. L. Guthrie, D. J. Peason, and M. B. Small, 'Chemical mechanical polishing for fabrication W metal features as chip interconnects', J. Electrochem. Soc., Vol. 138, No. 11, p. 3460, 1991
G. S. Grover, H. Liang, S. Ganeshkumar, and W. Fortino, 'Effect of slurry viscosity modification on oxide and tungsten CMP', Wear, Vol. 214, Iss. 1, p. 10, 1998
E. A. Kneer, C. Raghunath, and S. Ragahavan, 'Electrochemistry of chemical vapor deposited tungsten films with relevance to chemical mechanical polishing, J. Electrochem. Soc., Vol. 143, No. 12, p. 4095, 1996
D. J. Stein, D. Hetherington, T. Guilinger, and J. L. Cecchi, 'In-situ electrochemical investigation of tungsten electrochemical behavior during chemical mechanical polishing', J. Electrochem. Soc., Vol. 145, No. 9,p. 3190, 1998
E. A. Kneer, C. Raghunath, V. Mathew, S. Ragahavan, and J. S. Jeon, 'Electrochemical measurements during the chemical mechanical polishing of tungsten thin films', J. Electrochem. Soc., Vol. 144, No.9, p. 3041, 1997
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
Free Access. 출판사/학술단체 등이 허락한 무료 공개 사이트를 통해 자유로운 이용이 가능한 논문
※ AI-Helper는 부적절한 답변을 할 수 있습니다.