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Abstract AI-Helper 아이콘AI-Helper

Due to the limitations of the channel length, the lateral spread for two-dimensional impurity distributions is critical for the analysis of devices including the integrated complementary metal oxide semiconductor (CMOS) circuits and high frequency semiconductor devices. The developed codes were then...

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AI 본문요약
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제안 방법

  • 8 nm and 233 nm, respectively. The developed model in this research showed an excellent simulation results as it also matched well with TEM data and TSUPREM们 From the different mask structures with different slope angles, the doping profiles determined with the developed model can be visualized and analyzed. The developed model for the implantation can be used in high energy as well as in low energy.
  • 3. Two-dimensional TEM measurement and simulation of arsenic implanted silicon after annealing and chemical etching treatment(60,000x magnification).
  • Two-dimensional arsenic and boron profiles in NMOS and PMOS devices for the doping of source and drain were demonstrated by chemical etching-method and with the use of verification through the SRIM, UT- MARLOWE simulation tools and developed model. The measured TEM data and simulation data are shown high correspondence.

대상 데이터

  • 5 nm and 125 nm, respectively. The channel lengths with measured XTEM data and developed model were 199.4 nm and 205 nm, respectively. The TSUPREM4 data for the vertical depth and the channel length were determined to be 125.
  • For the arsenic implanted silicon, the vertical depths with the developed model and XTEM data were 79 nm and 83 nm, respectively. The channel lengths with measured XTEM data and developed model were 237 nm and 259 nm, respectively. The TSUPREM4 data for the vertical depth and the channel length were determined to be 85.

이론/모형

  • Two-dimensional distributions of implanted impurities were visualized by using chemical etching and electron hography[14-17j, and the developed model was compared with two- dimensional simulation data obtained using TSUPREM4 [18, 19]. In the simulation, all annealing processes were carried out using proper diffusion coefficients[20, 21 ] for the exact spreading diffusion effects. The output data of developed analytical model concurred with the measured TEM data after furnace annealing.
  • 3. Sample preparations for the TEM measurements were carried out fast and easily using FIB (Focused Ion Beam) tool. For the experimental condition of the FIB, the beam current was 1-pA and the gallium ions as a source element were accelerated with 30-keV.
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참고문헌 (23)

  1. W. C. Jung, 'A study of boron profiles by high energy ion implantation in silicon', J. of KIEEME (in Korean), Vol. 15, No.4, p. 289, 2002 

  2. W.-C. Jung, 'I-V and C-V measurements of fabricated $P^{+}/N^{+}$ junction diode in antimony doped (111) silicon', Trans. EEM, Vol. 3, No. 2, p. 10, 2002 

  3. W.-C. Jung, 'A study of experiment and developed model by antimony high energy implantation in silicon', J. of KIEEME(in Korean), Vol. 17, No. 11, p. 1156, 2004 

  4. H. Ruecker, B. Henemann, R. Bath, D. Bolze, V. Melnik, D. Krueger, and R. Kurps, 'Formation of shallow source/drain extensions for metal-oxide-semiconductor field-effect', Vol. 82, No.5, p. 826, 2003 

  5. J. P. Biersack, 'Basic physical aspects of high energy implantation', Nucl. Inst. and Meth. B, Vol. 35, p. 205, 1988 

  6. H. H. Andersen and J. F. Ziegler, 'Hydrogen, stopping power and ranges in all elements', The Stopping and Ranges of Ions in Matter edited by J. F. Ziegler, Pergamon, New York, Vol. 6, p. 64, 1977 

  7. U. Littmark and J. F. Ziegler, 'Handbook of range distributions for energetics ions in all elements', The Stopping and Ranges of Ions in Matter edited by J. F. Ziegler, Pergamon, New York, Vol. 6, p. 45, 1980 

  8. J. F. Ziegler, 'Ion Implantation Science and Technology', Ion Implantation Technology Co., New Jersey, p. 125, 1996 

  9. J. F. Ziegler, 'The stopping of energetic light ions in elemental matter', J. Appl. Phys., Vol. 85, No.3, p. 1249, 1999 

  10. J. F. Ziegler, 'SRIM 2000 manual', http://www.srim.org 

  11. J. F. Ziegler, J. P. Biersack, and U. Littmark, 'The stopping and range of ions in matter', Vol. 1, New York: Pergamon Press, p. 45, 1985 

  12. K. M. Klein, C. Park, and A. F. Tasch, 'Ultra shallow junction formation in silicon using implantation', IEEE Trans. Electron Devices ED Vol. 39, p. 1614, 1992 

  13. A. F. Tasch and S. K. Banerjee, 'Ultra shallow junction formation in silicon using ion implantation', Nucl. Inst. and Meth. In Phys. B, Vol. 112, p. 177, 1996 

  14. R. Brindos, P. Keys, K. S. Jones, and M. E. Law, 'Effects of arsenic doping on {311} defect dissolution in silicon', Appl. Phys. Letters, Vol. 75, No.2, p. 229, 1999 

  15. H. Cerva, 'Two-dimensional delineation of shallow junctions in silicon by selective etching of transmission electron microscopy cross sections', J. Vac. Sci. Technol. B, Vol. 10, No.1, p. 491, 1992 

  16. M. A. gribelyuk, M. R. McCartney, J. Li, C. S. Murthy, P. Ronsheim, B. Doris, J. S. McMurray, S. Hegde, and d. J. Smith, 'Mapping of electrostatic potential in deep submicron CMOS devices by electron holography', Phy. Rev. Lett., Vol. 89, No. 2, p. 1, 2002 

  17. K. D. Yoo, C. D. Marsh, and G. R. Booker, 'Two-dimensional dopant concentration profiles from ultra-shallow junction metal-oxide-semiconductor field-effect transistors using the etch/transmission electron microscopy method', Appl. Phys. Letters, Vol. 80, No. 15, p. 2687, 2002 

  18. Synopsys Inc., 'http://www.synopsis.com', TCAD, Taurus TSUPREM4, 2006 

  19. J. D. Plummer, M. D. Deal, and P. B. Griffin, 'Silicon VLSI Technology', Prentice Hall, Inc., p. 451, 2000 

  20. R. B. Fair, 'The role transient damage annealing in shallow junction formation', Nucl. Instr. and Meth. B, Vol. 37/38, p. 371, 1989 

  21. R. C. Jaeger, 'Introduction to Microelectronic Fabrication', Prentice Hall, New Jersey, 2002 

  22. R. P. Webb and E. Maydell, 'Comparisons of fast algorithms for calculation of range profiles in layered structures', Nucl. Inst. and Meth. B, Vol. 33 p. 117, 1988 

  23. R. Smith, 'Atomic and Ion Collisions in Solids and at Surface', Cambridge University Press, 1997 

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