초록

우주 비행체 전자장비의 신뢰도를 예측하고 최적화하기 위해 탑재장치 내 부품의 온도 예측이 필수적으로 요구된다. 본 논문에서는 전자장비 부품의 온도 예측방법에 관해 기술하고 있다. 본 예측 방법은 PCB 기판의 열전도도를 등방성모델로 설정하여 등가 열전도도를 계산하고 열력 모델을 이용하여 열 저항 행렬을 생성하였으며, 중첩의 원리를 이용하여 각 부품들의 온도를 예측하였다. 또한 본 논문의 온도 예측방법을 이용하여 전장품 소자의 열해석 결과와 상용 프로그램을 이용한 온도 계산 결과를 비교 분석하였다.

Abstract

Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.

주제어

#Thermal Analysis   #Thermal Conduction   #Thermal Resistance Matrix   #Superposition  

저자의 다른 논문

참고문헌 (9)

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이 논문을 인용한 문헌 (3)

1. Kim, Joo-Nyun ; Kim, Bo-Gwan 2007. "A Study on Reliability-driven Device Placement Using Simulated Annealing Algorithm" 電子工學會論文誌. Journal of the Institute of Electronics Engineers of Korea. SD, 반도체, 44(5): 42~49  원문보기 상세보기
2. Jeong, Min-Soo ; Kim, Mun-Gyeom ; Park, Young-Hoan ; Bang, Soon-Young 2008. "Development of Diagnosis System Adopted Intelligent Smart Junction Box for Improving Vehicular Power Safety" 전기학회논문지 = The Transactions of the Korean Institute of Electrical Engineers, 57(2): 276~285  원문보기 상세보기
3. Lee, Won-Hee ; Yu, Young-Joon ; Kim, Ho-Yong 2011. "A Study on the Thermal Design for A Signal Processor in the Micro-Wave Seeker" 韓國航空宇宙學會誌 = Journal of the Korean society for aeronautical & space sciences, 39(1): 76~83  원문보기 상세보기