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NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.26 no.3 = no.216, 2009년, pp.122 - 128
선명수 (서울산업대학교 NID 융합기술대학원) , 차성훈 (서울산업대학교 NID 융합기술대학원) , 김종봉 (서울산업대학교 자동차공학과) , 김종호 (서울산업대학교 금형설계학과) , 김성영 ((주)어플라이드 플라즈마) , 이혜진 (한국생산기술연구원)
DBD(Dielectric Barrier Discharges) plasma is often used to clean the surface of semiconductor. The cleaning performance is affected mainly by plasma density and duration time. In this study, the plasma density is predicted by coupled simulation of flow, chemistry mixing and reaction, plasma, and ele...
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Sze, S. M., "Pina Technology, 2nd.," Mcgraw-Hill International, p. 184, 1988
Lee, C. H., Kim, D. H., Lee, N. E. and Kwon, G. C., "Effect of different frequency combination on ArF photoresist deformation and silicon dioxide etching in the dual frequency superimposed capacitively coupled plasmas," Journal of Vacuum Science & Technology A, Vol. 24, No. 4, pp. 1386-1394, 2006
Kim, Y. S., Lim, H. E., Han, S. H., Lee, Y. H. and Kim, Y. S., "Wettability and Aging Effect of Polystyrene Film Treated by PSII according to the Molecular Weight," Analytical Science & Technology, Vol. 15, No. 3, pp. 229-235, 2002
Lee, E. S., Choi, J. H. and Baik, H. K., "Surface cleaning of indium tin oxide by atmospheric air plasma treatment with the steady-state airflow for organic light emitting diodes," Surface & Coatings Technology, Vol. 201, No. 9-11, pp. 4973-4978, 2007
Hollander, A. and Behnisch, J., "Low pressure plasma treatments inside a closed package," Surface & Coatings Technology, Vol. 142-144, pp. 1074-1077,2001
Ko, S. K., "Molecular Design and Surface Modification by Ion beam/Plasma Irradiation," Report of Molecular Design and Surface Modification by Ion beam/Plasma Irradiation, pp. 19- 22, 2000
Kim, N. H., "Studies on the developing metal dry etcher with lower source power," Report of Energy/Resource Technology Development, pp. 10- 16, 2006
Jiang, W., Xu, X., Dai, Z. -L. and Wang, Y. -N., "Heating mechanisms and particle flow balancing of capacitively coupled plasmas driven by combined dc/rf sources," Physics of Plasmas, Vol. 15, No. 3, pp. 033502-033505, 2008
Yi, C. H., Jeong, C. H., Lee, Y. H., Ko, Y. W. and Youm, G. Y., "Oxide surface cleaning by an atmospheric pressure plasma," Suface & Coatings Technology, Vol. 177-178, pp. 711-715, 2004
Han, S. M., Kim, S. J., Park, J. H., Choi, S. H. and Han, M. K., "High quality nanocrystalline silicon thin film fabricated by inductively coupled plasma chemical vapor deposition at 350 $^{\circ}C$ ," J. of Noncrystalline Solid, Vol. 354, Issues 19-25, pp. 2268- 2271, 2008
Kolobov, V. I., "Fokker-Planck modeling of electron kinetics in plasmas and semiconductors," Computational Materials Science, Vol. 28, Issue 2, pp. 302-320, 2003
Li, X., Li. L., Hua, X., Oehrlein, G. S., Wang, Y., Vasenkov, A. V. and Kushner, M. J., "Properties of C4F8 inductively coupled plasmas. I. Studies of Ar/c- $C_4F_8 $ magnetically confined plasmas for etching of $SiO_2$ ," Journal of Vacuum Science & Technology A, Vol. 22, No. 3, pp. 500-510, 2004
Arslandbekov, R. R. and Kolobov, V. I., "Twodimensional simulations of the transition from Townsend to glow discharge and submormal oscillations," J. of Phys. D: Appl. Phys., Vol. 36, No. 23, pp. 2986-2994, 2003
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