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논문 상세정보

플립칩의 반복 굽힘 시험 시 파손 특성에 관한 실험적 연구

An Experimental Study on the Failure Characteristics of Flip Chips in Cyclic Bending Test

Abstract

In general, circuit board assemblies experience various mechanical loadings during assembly and in actual use. The repeated cyclic bending can cause electrical failures due to circuit board cracks, solder interconnects cracks, and the component cracks. In this paper, we report on the failure characteristics of semiconductor chips under the repeated cyclic bending. We first describe a new 4-point bending tester, which is developed according to JEDEC standard No. 22B113. The performance of the tester is then estimated through actual experiments. Test results reveal that the cracks first occur on the outer balls around 20,000 cycles and gradually propagate to the inner balls where cracks are found around 70,000 cycles.

참고문헌 (10)

  1. Shed, A., 2004, "Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joint," 54th ECTC, Las Vegas, Nevada, USA, pp. 737-746. 
  2. She, A., 2001, "Predicting Solder Joint Reliability for Thermal, Power, and Bend Cycle within 25% Accuracy," 2001 Electronic Components and Technology Conference, pp. 255-263. 
  3. Hossain, M., and Agonafer, D., 2004, "Strain based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound using Finite Element Modeling," 2004 International Society Conference on Thermal Phenomena, pp. 358-367. 
  4. Darveaux, R., 1997, "Solder Joint Fatigue Life Model, in Design and Reliability of Solders and Solder Interconnections," The Minerals, Metals and Materials Society (TMS), Orlando, Florida, USA, pp. 213-218. 
  5. Shin, K H., Kim, H. T., and Jang, D. Y., 2007, "An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages," Transactions of KSMTE, Vol. 16, No.5. 
  6. JEDEC, 2006, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products, JESD22-B113:2006, Joint Electron Device Engineering Council. 
  7. JEDEC, 2006, Board Level Drop Test Method of Components for Handheld Electronic Products, JESD22-B111:2006, Joint Electron Device Engineering Council. 
  8. Jee, Y. K, 2006, "A Comparative Study of the PCB Surface Finish on the Mechanical Reliability of Solder joint in Micro electronic Packaging," M. S. thesis, KAIST, Republic of Korea. 
  9. Lee, W. J., 2004, "Board Level Reliability for Lead-Free Solder Joint Using Low Temperature Solder," M. S. thesis, Hanyang University, Republic of Korea. 
  10. Wu, J. D., Ho, S. H., Huang, C. Y., Liao, C. C., Zheng, P. J., and Hung, S. C., 2002, "Board Level Reliability of a stacked CSP subjected to cyclic bending," Microelectronics Reliability, Vol. 42, pp. 408-409. 

이 논문을 인용한 문헌 (2)

  1. Jang, Seung-Ho 2010. "A Study on the Rotating Ring Using Air Bearing in Yarn Manufacturing Process" 한국공작기계학회지 = Journal of the Korean society of machine tool engineers, 19(5): 622~630 
  2. Jeong, Jong-Seol ; Shin, Ki-Hoon ; Kim, Jong-Hyeong 2011. "Estimation of Mechanical Properties of Sn-xAg-0.5Cu Lead-free Solder by Tensile Test" 大韓溶接·接合學會誌 = Journal of the Korean Welding and Joining Society, 29(1): 41~45 

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