The microbolometer array sensor with fine pitch pixel array has been implemented to the released amorphous silicon layer supported by two contact pads. For the design of focal plane mirror with geometrical flatness, the simple beam test structures were fabricated and characterized. As the beam length decreased, the effect of beam width on the bending was minimized, Mirror deformation of focal plane in a real pixel showed downward curvature by residual stress of a-Si and Ti layer. The mirror tilting was caused by the mis-align effect of contact pad and confirmed by FEA simulation results. The properties of bolometer have been measured as such that the NETD 145 mK, the TCR -2 %/K, and thermal time constant 1.99 ms.
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이 논문을 인용한 문헌 (1)
Han, Chang Suk ; Park, Seung Man ; Kim, Nam-Hwan ; Han, Seungoh 2013. "SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler" Journal of sensor science and technology = 센서학회지, 22(1): 44~48