최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기Transactions on electrical and electronic materials, v.15 no.4, 2014년, pp.217 - 220
Cho, Tae-Sik (Department of Nano Materials Engineering, Kyungpook National University) , Chae, Mun-Seok (Department of Nano Materials Engineering, Kyungpook National University) , Cho, Chul-Sik (Laboratory, Sanko Korea Co.)
We studied the plating properties of Sn-Pb solder according to the shape of the Cu wire's cross-section for photovoltaic ribbon. The thickness of the Sn-Pb layer largely decreased to 29% on a curved Cu surface, compared to a flat Cu surface. This phenomenon is caused by the geometrical decrease in t...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
D. M. Bagnall and M. Boreland, Energy Policy, 36, 4390 (2008) [DOI: http://dx.doi.org/10.1016/j.enpol.2008.09.070].
R. Lathrop and K. Pfluke, Proc. of the 26th European Union Photovoltaic Solar Energy Conf., 1 (Hamburg, Germany, 2011).
G. F. Wakefield, W. Hills, and Calif, Methode for Ribbon Solar Cell Fabrication, U.S. Patent, 4, 323, 419 (1982).
J. Wendt, M. Trager, R. Klengel, M. Petzold, D. Schade, and R. Sykes, IEEE Intersociety Conference on Thermal and Thermomech- anical Phenomena in Electronic Systems, 1 (2010).
J. S. Jeong, N. C. Park, and C. W. Han, Microelectronics Reliability, 52, 2326(2012) [DOI: http://dx.doi.org/10.1016/j.microrel.2012.06.027].
Y. M. Chen, Y. P. Chiu, and H. W. Wu, Genetic Programming and Evolvable Mechanics, 1, 51(2012).
K. Uehara and M. Sakurai, J. of Materials Processing Technology, 127, 178 (2002) [DOI: http://dx.doi.org/10.1016/S0924-0136(02)00122-X].
J. Kim, K. S. Kim, and Y. H. Kim, J . of Adhesion Science and Technology, 3, 175 (1989) [DOI: http://dx.doi.org/10.1163/156856189X00146].
B. J. Loveab and P. F. Packmanc, J. of Adhesion, 40, 139 (1993) [DOI: http://dx.doi.org/10.1080/00218469308031280].
M. Sexsmith and T. Troczynski, J. of Thermal Spray Technology, 3, 404(1994) [DOI: http://dx.doi.org/10.1007/BF02658986].
J. D. Bobyn, G. J. Wilson, D. C. MacGregor, R. M. Pilliar, and G. C. Weatherly, J. of Biomedical Materials Research, 16, 571 (1982) [DOI: http://dx.doi.org/10.1002/jbm.820160505].
M. G. Chu, Y. Shiohara, and M. C. Flemings, Metallurgical transactions A, 15, 1303 (1984) [DOI: http://dx.doi.org/10.1007/BF02648558].
J. H. Lee, Y. H. Lee, and Y. S. Kim, Scripta Meterialia, 42, 789 (2000) [DOI: http://dx.doi.org/10.1016/S1359-6462(99)00431-5].
M. Schaefer, R. A. Fournelle, and J. Liang, J. of Electronic Materials, 27, 1167 (1998) [DOI: http://dx.doi.org/10.1007/s11664-998-0066-7].
C. Y. Liu, C. Chen, and K. N. Tu, J. of Applied Physics, 88, 5703 (2000). http://dx.doi.org/10.1063/1.1319327].
S. K. Kang, P. S. Rai, and S. Purushothaman, J. of Electronic Materials, 25, 1113 (1996) [DOI: http://dx.doi.org/10.1007/BF02659912].
W. R. Osorio, E. S. Freitas, L. C. Peixoto, J. E. Spinelli, and A. Garcia, J. of Power Source, 207, 183 (2012) [DOI: http://dx.doi.org/10.1016/j.jpowsour.2012.01.060].
B. S. Chiou, K. C. Liu, J. G. Duh, and P. S. Palanisamy, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 13, 267 (1990) [DOI: http://dx.doi.org/10.1109/33.56156].
H. H. Manko, Solders and soldering (McGraw-Hill, New York, 2001), p.2-13,21-27.
M. N. Islam, Y. C. Chan, M. J. Rizvi, and W. Jillek, J. of Alloys and Compounds, 400, 136 (2005) [DOI: http://dx.doi.org/10.1016/j.jallcom.2005.03.053].
P. Schmitt, P. Kaiser, C. Savio, M. Tranitz, and U. Eitner, Energy Procedia, 27, 664 (2012) [DOI: http://dx.doi.org/10.1016/j.egypro.2012.07.126].
H. K. Yeo and K. H. Han, J. of Alloys and Compounds, 477, 278 (2009).http://dx.doi.org/10.1016/j.jallcom.2008.10.150
A. Wedi, D. Baither, and G. Schmitz, Scripta Materialia, 64, 689 (2011) [DOI: http://dx.doi.org/10.1016/j.scriptamat.2010.12.026
A. W. Adamson and A. P. Gast, Physical Chemistry of Surfaces (John Wiley & Sons Inc., New York, 1997), p. 352-354.
R. Tadmor, Langmuir, 20, 7659 (2004) [DOI: http://dx.doi.org/10.1021/la049410h].
E. Chibowski and K. Terpilowski, Journal of Colloid and Interface Science, 319, 505 (2008) [DOI: http://dx.doi.org/10.1016/j.jcis.2007.10.059].
P. G. de Gennes, Reviews of Modern Physics, 57, 827(1985) [DOI:http://dx.doi.org/10.1103/RevModPhys.57.827].
M. A. Green, K. Emery, D. L. King, Y. Hishikawa, and W. Warta, Progress in Photovoltaic: Research and Applications, 15, 35 (2007) [DOI: http://dx.doi.org/10.1002/pip.741].
L. L. Kazmerski, J. Elec. Spectroscopy and Related Phenomena, 150, 105 (2006) [DOI: http://dx.doi.org/10.1016/j.elspec.2005.09.004].
P. V. Pesavento, R. J. Chesterfield, C. R. Newman, and C. D. Frisbie, J. of Applied Physics, 96, 7312 (2004) [DOI: http://dx.doi.org/10.1063/1.1806533].
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
오픈액세스 학술지에 출판된 논문
※ AI-Helper는 부적절한 답변을 할 수 있습니다.