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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.22 no.4, 2015년, pp.15 - 23
노명훈 (오사카 대학교 접합과학연구소) , (오사카 대학교 접합과학연구소) , 정재필 (서울시립대학교 공과대학 신소재공학과)
Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinter...
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핵심어 | 질문 | 논문에서 추출한 답변 |
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파워 모듈에는 어떤 것들이 있는가? | 1-3) 전력반도체는 시스템 반도체나 메모리 반도체와 비교해서 고내압, 고전류, 고주파수화 되어있다. 파워 모듈은 전력반도체의 한 유형으로 MOSFETs (Metal oxide semiconductor field effect transistor) 모듈, IGBT(Insulated gate bipolar transistor) 모듈, Diode 모듈, Thyristors 모듈 등이 있다.4) Fig. | |
차량에 장착되는 파워 모듈에게 요구되는 성능은 무엇인가? | 1는 하이브리드차의 전기구동부품을 보인 것으로, 파워 모듈이 주로 장착되는 인버터/컨버터 역시 핵심 부품 중 하나이다.5) 차량에 장착되는 파워 모듈은 안전과 매우 밀접한 관계가 있기 때문에 높은 수준의 내구성과 신뢰성이 요구된다.6,7) Fig. | |
은(Ag)과 구리(Cu) 나노 분말로 제조한 페이스트의 장점은? | 10-18) 이 중 금속 페이스트를 이용한 소결 기술은 은(Ag)과 구리(Cu) 나노 분말로 제조한 페이스트를 이용하여 칩과 기판, 기판과 기판을 접합하는 것이 대표적이다. 금속 나노 분말로 제조한 페이스트를 이용할 경우 금속의 녹는점보다 낮은 200~300oC에서 소결이 가능하고, 접합 후의 녹는점은 벌크 금속과 동일하기 때문에 파워 모듈에 사용되는 칩의 작동 온도인 200~250oC 보다 높다. 따라서 본고에서는 금속 페이스트를 이용한 소결 기술 중 현재 가장 활발히 연구가 진행되고 있는 은 페이스 트를 이용한 접합 기술에 대해 기술하고자 한다. |
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