Semiconductor manufacturing, the central to the electronics industry, is one of the most complex manufacturing systems found today. Due to the extremely large capital investment and sales revenue, the improvement of scheduling could result in a considerable amount of increased profits. Job release control is an essential part of scheduling. This paper is concerned with the applicability of four existing job release methodologies in semiconductor wafer fabrication, including deterministic time interval job release (DTI), KANBAN, CONWIP, and pull from bottleneck (PFB). Actual industrial data are used to build the wafer fabrication simulation model, which is developed by AutoSchedTM AP software. The results show that KANBAN is not appropriate for a complex system like wafer fabrication. The results of DTI, CONWIP, and PFB are only slightly different. Further research is necessary to develop the practical job release methodology for the real wafer fabrication environment.
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