BUTTONED SOLDERING PAD FOR USE WITH FINE-PITCH HOT BAR SOLDERING
원문보기
IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
H05K-001/11
H05K-001/18
H05K-003/34
출원번호
US-0539545
(2014-11-12)
공개번호
US-0138742
(2015-05-21)
발명자
/ 주소
Nguyen, Henry
Zhou, Yuxin
Gek-Teng, Tay
출원인 / 주소
Nguyen, Henry
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and
A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.
대표청구항▼
1. A buttoned soldering pad comprising: a soldering pad; andone or more first button heads protruding from a first surface of the soldering pad. 2. The buttoned soldering pad of claim 1, wherein each first button head has a width dimension that is smaller than, larger than, or is about the same size
1. A buttoned soldering pad comprising: a soldering pad; andone or more first button heads protruding from a first surface of the soldering pad. 2. The buttoned soldering pad of claim 1, wherein each first button head has a width dimension that is smaller than, larger than, or is about the same size of a width dimension of the soldering pad. 3. The buttoned soldering pad of claim 1, comprising one or more second button heads protruding from a second surface of the soldering pad, the second surface being opposite of the first surface. 4. The buttoned soldering pad of claim 3, each first button head on the first surface of the soldering pad having a button core extending to a corresponding second button head. 5. The buttoned soldering pad of claim 3, wherein each first button head, button core and second button head combination is an integrated member. 6. The buttoned soldering pad of claim 3, wherein each first button head, button core and second button head include separate members that are coupled together. 7. The buttoned soldering pad of claim 3, further comprising: a center substrate;a first soldering pad member having the first surface of the soldering pad located on a first side of the center substrate;a second soldering pad member having a the second surface of the soldering pad located on a second side of the center substrate, the first side being opposite of the second side of the center substrate such that the first buttons are protrude in a direction opposite from the protrusion of the second buttons; anda button core member extending between the first button head and second button head, the button core being thermally and electronically conductive. 8. The buttoned soldering pad of claim 7, wherein: the center substrate includes one or more substrate apertures extending therethrough; andeach first button head having a button core extending through the one or more substrate apertures to a corresponding second button head. 9. The buttoned soldering pad of claim 8, wherein the soldering pad includes one or more pad apertures extending therethrough, each button core extending through one of the one or more pad apertures to the corresponding second button head. 10. An electronic device comprising: the buttoned soldering pad of claim 1; andelectronic traces on a substrate that are electronically coupled with the buttoned soldering pad. 11. An electronic device comprising: the buttoned soldering pad of claim 7; andelectronic traces on the center substrate that are electronically coupled with the buttoned soldering pad. 12. An electronic device comprising: a first electronic component having a first buttoned soldering pad;a second electronic component having a second buttoned soldering pad, the first and second buttoned soldering pads being configured according to claim 1; anda first solder located around a first button head of the first buttoned soldering pad and located around a second button head of the second buttoned soldering pad. 13. The electronic device of claim 12, further comprising: the first electronic component having a third buttoned soldering pad;the second electronic component having a fourth buttoned soldering pad, the third and fourth buttoned soldering pads being configured according to the first and second buttoned soldering pads; anda second solder located around a third button head of the third buttoned soldering pad and located around a fourth button head of the fourth buttoned soldering pad; anda gap between the first and second solder. 14. The electronic device of claim 13, wherein, the first buttoned soldering pad and third buttoned soldering pad are electronically isolated from each other by the gap; andthe second buttoned soldering pad and fourth buttoned soldering pad are electronically isolated from each other by the gap. 15. A method of soldering electronic components together, the method comprising: providing a first electronic component having a first buttoned soldering pad, the first buttoned soldering pad including: a first soldering pad; andone or more first button heads protruding from a first surface of the soldering pad;providing a second electronic component having a soldering pad; andsoldering the first buttoned soldering pad to the soldering pad so as to electronically couple the first electronic component to the second electronic component. 16. The method of claim 15, comprising introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. 17. The method of claim 16, comprising: introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad;introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; andforming spaces between the first and second solder that electronically insulate the first solder from the second solder. 18. The method of claim 17, comprising: introducing the second solder so as to electronically couple the one or more second buttons with a second soldering pad of the second electronic component. 19. The method of claim 15, comprising performing hot bar soldering for the soldering. 20. The method of claim 19, comprising contacting a hot bar soldering apparatus with the first buttoned soldering pad so as to transfer heat therethrough to heat solder associated with the one or more first button heads and the soldering pad. 21. The method of claim 18, comprising performing the soldering so that the solder is retained in spaces created by the one or more first button heads between the first soldering pad of the first electronic component and the soldering pad of the second electronic component. 22. The method of claim 18, comprising performing the soldering so as to inhibit solder from bridging between adjacent buttoned soldering pads of the first electronic component. 23. The method of claim 18, comprising performing the soldering so as to inhibit solder from bridging between adjacent soldering pads of the second electronic component. 24. The method of claim 18, comprising applying pressure by a hot bar soldering apparatus in an amount that does not cause solder bridging between adjacent buttoned soldering pads the first electronic component. 25. The method of claim 18, comprising: imaging an area around the soldered first buttoned soldering pad and soldering pad; anddetermining whether or not there is solder bridging between adjacent buttoned soldering pads of the first electronic component and/or determining whether or not there is solder bridging between adjacent soldering pads of the second electronic component. 26. The method of claim 25, wherein if there is solder bridging between adjacent buttoned soldering pads and/or between adjacent soldering pads, an electronic device having the solder bridging is discarded. 27. The method of claim 26, wherein if there is no solder bridging between adjacent buttoned soldering pads and/or between adjacent soldering pads, an electronic device devoid of solder bridging is further processed to prepare the electronic device.
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