Shipowners Refrigerated Cargo Research Association
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Baldwin, Wight & Brown
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28인용 특허 :
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초록▼
In a refrigeration system for a substantially enclosed space and including a compressor, a condenser, an evaporator, conduit means connecting the said compressor, condenser and evaporator to form a cooling circuit, and a hot gas by-pass conduit between the compressor and the evaporator, the improvem
In a refrigeration system for a substantially enclosed space and including a compressor, a condenser, an evaporator, conduit means connecting the said compressor, condenser and evaporator to form a cooling circuit, and a hot gas by-pass conduit between the compressor and the evaporator, the improvement which comprises means provided in the system for apportioning flow of gas between the cooling circuit and the by-pass conduit so that, during a temperature controlling phase of refrigeration, the gas flows both to the condenser and to the by-pass conduit and the apportioning of flow can cause either net heating or net cooling of the enclosed space.
대표청구항▼
1. In a refrigeration system for a substantially enclosed space and including a compressor, a condenser, an evaporator, conduit means connecting said compressor, condenser and evaporator to form a cooling circuit, a hot gas by-pass conduit between the compressor and the evaporator and a thermostat w
1. In a refrigeration system for a substantially enclosed space and including a compressor, a condenser, an evaporator, conduit means connecting said compressor, condenser and evaporator to form a cooling circuit, a hot gas by-pass conduit between the compressor and the evaporator and a thermostat which is sensitive to the heating or cooling requirement of the space, the improvement which comprises a first valve responsive to said thermostat provided in the hot gas by-pass conduit, a second valve responsive to said thermostat provided in the cooling circuit, the second valve having a permanently open by-pass, and means provided in the system for apportioning flow of gas between the cooling circuit and the by-pass conduit so that, during a temperature controlling phase of refrigeration, the gas flows both to the condenser and to the by-pass conduit and the apportioning of flow can cause either net heating or net cooling of the enclosed space, and in which the means apportioning the flow is so arranged that when first and second valves are open, there is net cooling of the space and that when said second valve is closed, there is net heating of the space. 2. The refrigeration system of claim 1 in which a third valve controlled by the thermostat is provided in the cooling circuit upstream of the condenser, said third valve having a permanently open by-pass. 3. The refrigeration system of claim 2 in which said first, second and third valves are solenoid valves. 4. The refrigeration system of claim 1 in which the means for apportioning flow is a throttling valve having means for variably apportioning gas between the cooling circuit and the hot gas by-pass conduit. 5. The refrigeration system of claim 4 in which the throttling valve is controlled by means responsive to ambient temperature so that as the ambient temperature falls the flow of gas along the by-pass conduit increases relative to the flow of gas in the cooling circuit. 6. The refrigeration system of claim 1 in which one of the cooling circuit and the hot gas by-pass conduit includes a valve and the other includes a pipe-line which is divided over at least part of its length into a plurality of pipes in parallel, each pipe having a valve and the valves being controlled by a multi-stage thermostat responsive to the heating or cooling requirement of the space so that one or more of the valves may be closed to apportion the flow of gas. 7. The refrigeration system of claim 6 in which the valves in the plurality of pipes are substantially identical to each other. 8. The refrigeration system of claim 6 in which each said pipe has a valve of a size different from those of the other said pipes. 9. The refrigeration system of claim 2 in which a flow of air is passed over the refrigerant evaporator and into said substantially enclosed space and in which a temperature sensor for the thermostatic control of the system is provided and is located in the air flow entering said space. 10. The refrigeration system of claim 1 in which a flow of air is passed over the refrigerant evaporator and into said substantially enclosed space and in which a temperature sensor for the thermostatic control of the system is provided and is located in the air flow entering said space. 11. The refrigeration system of claim 7 in which the said first and second valves are solenoid valves. 12. The refrigeration system of claim 11 in which a third solenoid valve controlled by the thermostat is provided in the cooling circuit upstream of the condenser, the said third valve having a permanently open by-pass. 13. The refrigeration system of claim 11 in which a flow of air is passed over the refrigerant evaporator and into the said substantially enclosed space and in which a temperature sensor for the thermostatic control of the system is provided and is located in the air flow entering the said space. 14. In a refrigeration system for a substantially enclosed space and including a compressor, a condenser, an evaporator, conduit means connecting the said compressor, condenser and evaporator to form a cooling circuit, and a hot gas by-pass conduit between the compressor and the evaporator, the improvement which comprises means provided in the system for apportioning flow of gas between the cooling circuit and the by-pass conduit so that, during a temperature controlling phase of refrigeration, the gas flows both to the condenser and to the by-pass conduit and the apportioning of flow can cause either net heating or net cooling of the enclosed space, the means for apportioning flow is a throttling valve having means for variably apportioning gas between the cooling circuit and the hot gas by-pass conduit, and the throttling valve being controlled by means responsive to ambient temperature so that, as to the ambient temperature falls, the flow of gas along the by-pass conduit increases relative to the flow of gas in the cooling circuit. 15. The refrigeration system of claim 14 in which a flow of air is passed over the refrigerant evaporator and into the said substantially enclosed space and in which a temperature sensor for the thermostatic control of the system is provided and is located in the air flow entering the said space.
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이 특허를 인용한 특허 (28)
Scrine Gerald R. (Cambridge GB2) Carter William D. M. (Huntingdon GB2), Apportioning means for refrigeration system.
Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Capacitively coupled plasma reactor having very agile wafer temperature control.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Capacitively coupled plasma reactor having very agile wafer temperature control.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, Williams W.; Zubillaga, Glenn W.; Millian, Isaac, Method for agile workpiece temperature control in a plasma reactor using a thermal model.
Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor.
Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of operating a capacitively coupled plasma reactor with dual temperature control loops.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using feed forward thermal control.
Brillhart, Paul Lukas; Fovell, Richard; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control.
Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with a multiple zone thermal control feed forward control apparatus.
Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Buchberger, Jr., Douglas A.; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with a multiple zone thermal control feed forward control apparatus.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J., Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes.
Buchberger, Jr., Douglas A.; Brillhart, Paul Lukas; Fovell, Richard; Tavassoli, Hamid; Burns, Douglas H.; Bera, Kallol; Hoffman, Daniel J.; Cowans, Kenneth W.; Cowans, William W.; Zubillaga, Glenn W.; Millan, Isaac, Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops.
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