[특허]Island assembly employing cooling means for high density integrated circuit packaging

Island assembly employing cooling means for high density integrated circuit packaging 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/24
출원번호	US-0513283 (1974-10-09)
발명자 / 주소	Braun Robert E. (Norristown PA) Jones Richard H. (Wayne PA) Sprenkle George J. (Phoenixville PA) Stopper Herbert (Orchard Lake MI)
출원인 / 주소	Burroughs Corporation (Detroit MI 02)
인용정보	피인용 횟수 : 31 인용 특허 : 0

초록 ▼

A system is described which provides for high density packaging of electronic equipment, particularly data processing systems. Subnanosecond integrated circuits of the LSI or MSI type in pluggable packages are adapted to be installed in receptacles or connectors. A cooling frame is provided which supports the package connectors as well as the package-to-package interconnection medium. In accordance with the system, groups of integrated circuit packages logically partitioned into functional elements and having, for example, gate complexities of the order of four thousand to ten thousand gates, comprise an island. The system may be expanded further by interconnecting several islands.

대표청구항 ▼

A packaging system for eleCtronic equipment comprising at least one island, said island including a plurality of integrated circuit packages, each package having a plurality of electrical conductors and a heat sink member with integral extensions at its opposite extremes, connector means mounting said packages, an interconnection medium having a plurality of conductive pads, each of said connector means having a plurality of electrical contacts and being operatively connected in predetermined relationship to said interconnection medium and providing respective electrical paths between said integrated circuit package electrical conductors and said interconnection medium conductive pads, and a cooling frame fastened to said interconnection medium on the same side thereof as said conductive pads, said cooling frame being configured such that a plurality of sections of thermally conductive material are situated in parallel spaced-apart relationship across the surface of said interconnection medium, each of said connector means being located in the space between an adjacent pair of said cooling frame sections, the heat sink member of each integrated circuit package mounted in said connector means straddling said means such that said integral extensions contact respectively said last mentioned pair of cooling frame sections.

이 특허를 인용한 특허 (31)

Daniel N. Donahoe ; Michael T. Gill, Apparatus for liquid cooling of specific computer components.
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Donahoe Daniel N. ; Gill Michael T., Apparatus for liquid cooling of specific computer components.
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Barry Caldwell, Apparatus suitable for mounting an integrated circuit.
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Ruckdeschel, Thomas W., Assembly for mounting power semiconductive modules to heat dissipators.
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Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
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Kaufman Lance R. (131 N. White Oak Way Mequon WI 53092), Circuit assembly with semiconductor expansion matched thermal path.
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Samaniego,Paul; Campbell,Levi; Ellsworth, Jr.,Michael; Domitrovits,Michael; Kelley,Paul; Mahaney, Jr.,Howard, Cold plate structure and method for cooling planar arrays of processors during assembly and test allowing for single module site reworkability.
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Lai, Chih-Ming; Kao, Yung-Shun; Chiang, Chung-Wei, Connector module.
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Bosler Alan J. (Bedford IN) Nash Larry E. (Washington IN), Cooling apparatus for electronic modules.
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Hutchison ; Robert V. ; Gregg ; Peter P. ; MacBride ; James J., Cooling system for dual-in-line packages.
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Koide Hiromichi,JPX ; Suzuki Shinya,JPX ; Tano Ichiro,JPX, Cooling system of a printed board.
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Porter Warren W. (Escondido CA) Lauffer Donald K. (Poway CA), Cryogenic vessel for cooling electronic components.
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Chu ; Bing-Lun ; Subbarao ; Wunnava Venkata ; Peale ; Jack ; McCune ; Ke nt ; Steiner ; Marvin Elroy, D-I-P On island.
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Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
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Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
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Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
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Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
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Patel Parbhubhai D. (Andover MA), Heat dissipating assembly for semiconductor devices.
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Hutchison ; Robert V. ; Gregg ; Peter P. ; MacBride ; James J., Heat pipe cooling for semiconductor device packaging system.
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McCullough Kevin A., Heat sink assembly with cam lock.
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Chen,Chun Chi; Wu,Yi Qiang; Zhao,Liang Hui, Heat sink mounting device.
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Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
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Smith, Stephen W.; Creek, William R., Integrated micromachine relay for automated test equipment applications.
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Smith, Stephen W.; Creek, William R., Integrated micromachine relay for automated test equipment applications.
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Romania Samuel R. (Phoenixville PA), Latch assembly for clamping electronic components.
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Rohner, Thomas G., Mechanical cooler for electronics.
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Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
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Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
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Welsh, James W., Retention and cooling of plug-in electronic modules in a high shock and vibration environment.
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Welsh, James W., Retention and cooling of plug-in electronic modules in a high shock and vibration environment.
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Cook Randolph H., Spring clamp assembly for improving thermal contact between stacked electronic components.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Island assembly employing cooling means for high density integrated circuit packaging 원문보기

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Island assembly employing cooling means for high density integrated circuit packaging 원문보기

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이 특허를 인용한 특허 (31)

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