초록 ▼

A method of manufacturing a transducer having a leaf spring cantilever beam with a strain gauge bonded to each side thereof by a layer of glass. Either one or both strain gauges and one or both glass layers are bonded simultaneously. The assembly is heated and a voltage applied to complete all bonds

A method of manufacturing a transducer having a leaf spring cantilever beam with a strain gauge bonded to each side thereof by a layer of glass. Either one or both strain gauges and one or both glass layers are bonded simultaneously. The assembly is heated and a voltage applied to complete all bonds without removing it from the oven. The simultaneous bonding without oven removal doubles or quadruples production and unexpectedly has the dual function of increasing yield by over one-third based upon matched gauge resistance and strength requirements.

대표청구항 ▼

The method of making a transducer, said method comprising the steps of: holding a layer of glass against a metal beam with a piece of auxiliary glass; holding a strain gauge against said layer; connecting the auxiliary glass to a first negative terminal of a first D.C. source of potential; connectin

The method of making a transducer, said method comprising the steps of: holding a layer of glass against a metal beam with a piece of auxiliary glass; holding a strain gauge against said layer; connecting the auxiliary glass to a first negative terminal of a first D.C. source of potential; connecting said strain gauge to the positive terminal on said first source; connecting one end of a loose first lead to said auxiliary glass; connecting one end of another loose second lead to said beam; heating an assembly including said layer of glass, said auxiliary glass, said strain gauge and said beam while the voltage of said first source is applied to the structures connected thereto until a bond is achieved between said strain gauge and said glass layer; disconnecting at least one of said first and second terminals; connecting said first and second leads to the third negative and fourth positive terminals of a second D.C. source of potential; and heating said assembly while said second source is connected as aforesaid until a bond is achieved between said layer and said beam, said assembly being kept in the self-same oven from the time said first heating step is performed until said layer is bonded to said beam.