초록

Method and apparatus are provided for depositing a coating of uniform thickness across a substrate coated by a vapor-deposition process, for confining and directing the vapor to the substrate in a manner to minimize vapor loss, and for conveniently collecting vapor which bypasses the substrate.

대표청구항 ▼

A process for coating a substrate comprising generating a vapor stream of coating material from a source of coating material, directing the vapor stream upwardly through a zone of confinement, confining the stream transversely about its upward direction in said zone of confinement, passing the subst

A process for coating a substrate comprising generating a vapor stream of coating material from a source of coating material, directing the vapor stream upwardly through a zone of confinement, confining the stream transversely about its upward direction in said zone of confinement, passing the substrate over said zone of confinement immediately adjacent the top thereof, further confining said vapor stream at the top of said zone of confinement transversely of its upward direction and parallel to the direction of travel of the substrate while maintaining the width of the further confined vapor stream greater than the width of the substrate and more narrow than the width of the confined vapor stream prior to said further confinement to the extent that low velocity components of the vapor stream do not conDense on the substrate and thereby obtain a coating material thickness that is constant for a greater portion of its width than if the vapor stream were not further confined and a coating thickness profile characterized by a maximum deviation within ±10% of its average coating weight, maintaining the distance between the source of coating material and the top of the zone of confinement at least about equal to the dimensional extent of the zone of confinement in the direction transverse to the direction of travel of the substrate, and condensing the further confined stream on said substrate.