초록 ▼

A sealing glass composition comprises a PbO-containing glass frit, two particulate refractory fillers having controlled particle size distributions, and optionally at least one additive to prevent the chemical reduction of the PbO when the frit is fired in the presence of reducing conditions. The se

A sealing glass composition comprises a PbO-containing glass frit, two particulate refractory fillers having controlled particle size distributions, and optionally at least one additive to prevent the chemical reduction of the PbO when the frit is fired in the presence of reducing conditions. The sealing glass composition is useful as a package sealant. It is especially useful as a solder glass for sealing a face plate portion to a funnel portion of a color television picture tube at temperatures of about 400°C. A particulate glass composition for use in preparing the sealing glass composition, a sealing glass paste and methods of using the sealing glass and paste are provided.

대표청구항 ▼

In a particulate glass composition comprising: a. at least about 70 weight percent of a PbO-containing glass frit component having a sealing temperature of between about 350° to about 415°C., and b. at least about 10-25 weight percent of at least one coarse particulate refractory filler component h

In a particulate glass composition comprising: a. at least about 70 weight percent of a PbO-containing glass frit component having a sealing temperature of between about 350° to about 415°C., and b. at least about 10-25 weight percent of at least one coarse particulate refractory filler component having a coefficient of thermal expansion of less than about 65 ×107 in./in./°C. (0°-300°C.) and a particle size distribution of about: ________________________________ -% of Particles Microns ________________________________ 90 ≤ 40-60 75 ≤ 30-45 50 ≤ 15-35 25 ≤ 7-20 10 ≤ 2-10 5 ≤ 0.5-3 ________________________________ the improvement comprising: c. at least about 0.25-10 weight percent of at least one fine particulate refractory filler component having a coefficient of thermal expansion of less than about 65 ×107 in./in./°C. (0°-300°C.) and a particle size distribution of about: ________________________________ -% of Particles Microns ________________________________ 90 ≤ 5-10 75 ≤ 3-8 50 ≤ 2-4 25 ≤ 0.8-2.5 10 ≤ 0.5-2.0 5 ≤ 0.2-1.5 ________________________________