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Process for bonding titanium, tantalum, and alloys thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-001/20
출원번호 US-0562729 (1975-03-27)
발명자 / 주소
  • Danna Peter A. (Milford CT) Holcomb Richard A. (Lake Charles LA) Roethlein Richard J. (Stafford Springs CT)
출원인 / 주소
  • Olin Corporation (New Haven CT 02)
인용정보 피인용 횟수 : 30  인용 특허 : 0

초록

A method of bonding film-forming metals and their alloys has been developed. The method comprises applying a first coating of a metal, compound, or alloy of the platinum metal group to the film-forming metal. A second coating of copper is then applied to the first coating. A second metal, such as st

대표청구항

A process for bonding a first film-forming metal selected from the group consisting of titanium, tantalum, zirconium, niobium, tungsten and alloys thereof to a second metal which comprises: a. applying a first coating of a platinum metal component selected from the group consisting of platinum group

이 특허를 인용한 특허 (30)

  1. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  2. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  4. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  5. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  6. Miller, Steven A.; Kumar, Prabhat, Low-energy method of manufacturing bulk metallic structures with submicron grain sizes.
  7. Lauterbach Richard (Munich DEX) Keller Hartmut (Poecking DEX), Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems.
  8. Zimmermann, Stefan; Papp, Uwe; Kreye, Heinrich; Schmidt, Tobias, Method for coating a substrate surface and coated product.
  9. Lorenz Rainer,DEX, Method of brazing titanium to stainless steel.
  10. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan, Methods of forming sputtering targets.
  11. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining metallic protective layers.
  12. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  13. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  14. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining protective metal-clad structures.
  15. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  16. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  17. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  18. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  19. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  20. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  21. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmerman, Stefan, Methods of rejuvenating sputtering targets.
  22. Spencer James R. (Sayre PA) Martin ; Jr. Harry D. (Troy PA), Printer wire for printer wire assembly, assembly and method for producing same.
  23. Adachi Yukio (Tokyo JPX) Honma Hiroshi (Tokyo JPX) Ohkouchi Satoshi (Tokyo JPX), Printing head apparatus and manufacturing method.
  24. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  25. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein Richard, Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  26. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Protective metal-clad structures.
  27. Fountain ; Laurence R., Surface preparation of a damaged braze for rebrazing.
  28. Lorenz, Rainer, Use of silver-copper-palladium brazing alloys.
  29. Lorenz, Rainer, Use of silver-copper-palladium brazing alloys.
  30. Rainer Lorenz DE, Use of silver-copper-palladium brazing alloys.
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