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Methods of fabricating low pressure silicon transducers

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B01J-017/00   
미국특허분류(USC) 29/583 ; 29/585 ; 29/590 ; 29/591
출원번호 US-0648957 (1976-01-14)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 31  인용 특허 : 1
초록

A low pressure transducer and methods of fabricating the same employ piezoresistive bridges deposited on or diffused within a wafer of n-type silicon, the wafer is secured to a glass sheet and is then bonded to a silicon diaphragm of a relatively large size and fabricated from a distinct piece of silicon of non-critical electrical characteristics. Methods for producing a plurality of such devices by using compatible processing steps are also provided.

대표
청구항
▼

The method of fabricating a transducer comprising the steps of: a. diffusing a plurality of piezoresistive patterns on a surface of a single n-type silicon wafer, b. bonding a thin glass sheet to the surface of said wafer opposite to that surface upon which said patterns are diffused, c. separating each of said patterns to form a plurality of individual patterns, and d. glass bonding each individual pattern on a separate diaphragm of silicon, of non-critical electrical properties as compared to said n-type wafer to form a plurality of separate diaphragm ...

이 특허에 인용된 특허 (1)

  1. Endo Teruyuki (Alhambra CA). Method of making a transducer. USP1976053953920.

이 특허를 인용한 특허 피인용횟수: 31

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Mallon Joseph R. (Franklin Lakes NJ) Kurtz Anthony D. (Englewood NJ). Binary balancing apparatus for semiconductor transducer structures. USP1982064333349.
  3. Fornara, Pascal; Rivero, Christian. Device for detecting the thinning down of the substrate of an integrated circuit chip. USP2015099121896.
  4. Fornara, Pascal; Rivero, Christian. Device for detecting the thinning down of the substrate of an integrated circuit chip. USP2013128618821.
  5. Kirsch ; Thomas. Electrical transducer and method of making. USP1978074100524.
  6. Grantham Daniel H. (Glastonbury CT) Swindal James L. (East Hampton CT). Electrostatic bonded, silicon capacitive pressure transducer. USP1983114415948.
  7. Kurtz Anthony D. (Teaneck NJ) Nunn Timothy A. (Ridgewood NJ) Weber Richard A. (Denville NJ). Fabrication of dielectrically isolated fine line semiconductor transducers and apparatus. USP1987064672354.
  8. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  9. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  10. Prudenziati Maria (Modena ITX). Force measurement device for controlling the position of an implement for towing by an agricultural machine. USP1984064456074.
  11. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  12. Wilner L. Bruce (Palo Alto CA) Wong Herbert V. (San Francisco CA). High temperature layered silicon structures. USP1985064523964.
  13. Stark, David H. Insulated glazing units. USP2010117832177.
  14. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  15. Swan, Johanna M.; Mahajan, Ravi V.; Natarajan, Bala. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme. USP2005066908845.
  16. Swan, Johanna M.; Natarajan, Bala; Chiang, Chien; Atwood, Greg; Rao, Valluri R.. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme. USP2005026848177.
  17. Swan,Johanna M.; Natarajan,Bala; Chiang,Chien; Atwood,Greg; Rao,Valluri R.. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme. USP2006097112887.
  18. Yeh, Wen-Yung; Yu, Yu-Chen; Yen, Hsi-Hsuan; Lin, Jui-Ying. Light-emitting systems. USP2014048704241.
  19. Delapierre Gilles (Seyssinet FRX). Measuring device using a strain gauge. USP1983114418326.
  20. Sparks Douglas Ray ; Viduya Andres Deogracias ; Little Lewis Henry ; Ellis Marion Edmond. Metal diaphragm sensor with polysilicon sensing elements and methods therefor. USP2000026022756.
  21. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  22. Zaeschmar Guenther (San Diego CA). Method of attaching LED chip to a header. USP1981064271584.
  23. Myhre Kjell E. (941 N. Enterprise Ave. Inglewood CA 90302). Method of making diaphragm of optimized stress and strain distribution. USP1979014133100.
  24. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  25. Myhre Kjell E. (941 Enterprise Ave. Inglewood CA 90302). Optimized stress and strain distribution diaphragms. USP1983034376929.
  26. Tominaga Tamotsu (Yokohama JPX) Mihara Teruyoshi (Yokohama JPX). Pressure sensor having semiconductor diaphragm. USP1982024314225.
  27. Peterson, Tom; Diaz, Jorge Andres Diaz; Cucci, Gerald R.. Sensor usable in ultra pure and highly corrosive environments. USP2003096612175.
  28. Peterson,Thomas; Diaz,Jorge Andres Diaz; Cucci,Gerald R.. Sensor usable in ultra pure and highly corrosive environments. USP2006127152478.
  29. Aine Harry E. (Two Palo Alto Sq. Palo Alto CA 94304). Solid state transducer and method of making same. USP1979034144516.
  30. Black James F. (Newington CT) Grudkowski Thomas W. (Glastonbury CT) DeMaria Anthony J. (West Hartford CT). Ultra-thin microelectronic pressure sensors. USP1984074463336.
  31. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.

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