[특허]Electronic cooling chassis

Electronic cooling chassis 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0612814 (1975-09-12)
발명자 / 주소	Lee Lawrence Y. (Santa Ana CA)
출원인 / 주소	L. H. Research (Santa Ana CA 02)
인용정보	피인용 횟수 : 51 인용 특허 : 0

초록 ▼

Electronic apparatus employing components generating substantial amounts of heat to be dissipated, and particularly solid state components, is in the form of a subassembly that includes a heat sink comprised of a plate or block of metal having a high coefficient of heat conductivity, such as aluminum, to which one or more solid state components may be secured and which also mounts heat radiating fins. The subassembly is slidably supportable in a holder by means of ribs on the inner surfaces of the walls of the holder cooperating with notches in the sides of the heat sink plate, and the holder may be made of dielectric material to electrically isolate the heat sink from an apparatus housing and from other heat sink plates when two or more heat sinks are supported in a holder. A circuit board carrying circuitry associated with the solid state components may be secured directly to one or more of the heat sink subassemblies. An alternate form of the present invention utilizes an extruded, thermally conductive heat radiator in thermal communication with a heat sink formed as a plate or block of metal having a high coefficient of heat conductivity. The heat sink plate is utilized for absorbing heat produced by electronic components mounted directly thereon and additionally is used to support a printed circuit board for carrying electronic components which do not require special heat dissipating radiators. This entire subassembly is mounted in an electronic chassis including a fan which directs a flow of air over the extruded heat radiator as well as the remaining electronic components mounted on the printed circuit board. The extruded heat radiator includes a flat base element and a plurality of radiating ribs extending normal to the flat base element. This flat base element provides an enlarged cross-sectional area for transfer of heat from the heat sink into the extruded radiator and may, in an alternate embodiment, provide a direct mounting base for semiconductor devices.

대표청구항 ▼

A substantially enclosed package for mounting electronic components, said package including: a prewired modular subassembly mounted within said enclosed package comprising: at least one heat damage susceptible component which generates heat at a deleterious level; a rectangular printed circuit board having two end edges shorter than its two side edges; a plurality of electronic components mounted directly on said printed board, at least some of which also dissipate heat; and a heat absorbing and radiating means secured to one end of said printed circuit board and extending substantially entirely across said end, said heat radiating means including: heat sink means comprising a high heat conductivity metallic member, said heat damage susceptible component being mounted on and in thermal communication with said metallic member, and fin means for radiating heat from said heat sink means, said fin means comprising a plurality of inexpensive cooling fins which are economical of material separated by uninterrupted parallel air passages directed longitudinally toward the other end of the printed circuit board and toward the electronic components mounted directly on said printed circuit board, said fin means being located closely proximate to said heat damage susceptible component so that an excellent heat conduction path is provided between said component and said cooling fins; a fan mounted to said package for producing an air flow within said package; and means for supporting said modular subassembly in said package so that said heat radiating means is entirely within said package in close juxtaposition with said fan and the surface area of said plural cooling fins is parallel to the air flow produced by said fan so that said air flow is directed in series through said plural uninterrupted air passages and longitudinally across said printed circuit board over said plurality of components mounted directly to the printed circuit board.

이 특허를 인용한 특허 (51)

Hanewinkel, III,William H; Williams,Mark G, Aircraft heat sink and electronics enclosure.
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Fuchs, Alfred, Arrangement for cooling electronic components and/or assemblies.
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Brehm Heinz (Nuremberg DEX) Weigand Adolf (Rckersdorf DEX), Assembly of an externally ventilated semiconductor arrangement.
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Sun,Xiaohua H.; Le,Don, Bottom exit of exhaust air from a chassis to reduce acoustics emission.
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Kenichi Wakabayashi JP; Chitoshi Takayama JP; Tadashi Shiozaki JP, Cartridge for electronic devices.
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Wakabayashi Kenichi,JPX ; Takayama Chitoshi,JPX ; Shiozaki Tadashi,JPX, Cartridge for electronic devices.
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Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
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Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
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Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
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Wakabayashi, Kenichi; Takayama, Chitoshi; Shiozaki, Tadashi, Cartridge for electronic devices.
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Wagner, Barry A.; Le, Don; Tsu, William P., Computer chassis with partitions for improved airflow.
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Marino Jerry C. (Sudbury MA) Bibeau Lawrence J. (Worcester MA), Computer mounting assembly.
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Hicks, Roy T., Cooling and power input assembly.
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Takigawa Hiroshi,JPX ; Nishikawa Yuji,JPX, Cooling device of a planar light source.
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Raynor Vester R. (Claremore OK) Knox Dick L. (Claremore OK), Cooling system for electrical components.
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Murayama Tomomi,JPX ; Ooka Satoshi,JPX ; Kamikawa Yoshinori,JPX, Electronic apparatus incorporating a circuit module having a heat sink.
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Volkmann Werner K. (Media PA), Electronic assembly with heat sink means.
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Kunkle, Jonathan, Electronic module configured for air flow therethrough and system including same.
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Kunkle, Jonathan, Electronic module configured for failure containment and system including same.
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Fujiwara Kaisaku (Kanagawa JPX) Yokooji Shigenori (Odawara JPX) Morishita Yasuji (Odawara JPX), Electronic parts-mounting device with easy assembly and maintenance.
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Takigawa Hiroshi,JPX ; Nishikawa Yuji,JPX, Fabrication of cooling device of a planar light source.
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Cheon Kioan, Fanless cooling system for computer.
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Nakamura Masakazu (Amagasaki JPX), Heat sink.
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Duesman Kevin G. ; Bissey L. Jan, Heat sink for chip stacking applications.
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Duesman, Kevin G.; Bissey, L. Jan, Heat sink for chip stacking applications.
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Kevin G. Duesman ; L. Jan Bissey, Heat sink for chip stacking applications.
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Papst Georg (St. Georgen DEX) Wrobel Guenter (Villingen DEX) Koletzki Ulrich (St. Georgen DEX), Heat sink for electronic devices.
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Denker Jerry B. (Cincinnati OH), Housing for electronic assembly including internally mounted heat sink.
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Kummle Wolfgang,DEX ; Stolle Dieter,DEX ; Schreiber Alfred,DEX, Housing for electronic units.
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Wakabayashi,Kenichi; Takayama,Chitoshi; Shiozaki,Tadashi, Information processing device.
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Matsubara, Kazuo; Matsubara, Terumi; Honma, Naoki; Suma, Hiroki, LED therapeutic apparatus having thermal radiating function.
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Takigawa Hiroshi,JPX ; Nishikawa Yuji,JPX, Method of making a cooling device of a planar light source.
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Rumbaugh ; Paul S., Modular printed circuit board assembly having cooling means incorporated therein.
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Young Peter L. (South Barrington IL) Chen Chiu-Chao (Hoffman Estates IL), Multichip thin film module.
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Dodson Douglas A., Multiple fan cooling device.
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Gigandet, Richard W., Oven control circuitry cooling system for a double-stack food preparation oven arrangement.
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Biethan ; Sr. John D. (2785 SW. 192nd Ave. Aloha OR 97005), Portable electric welder.
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Mouri,Yoshitaka, Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency.
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Hess Joachim (D-8070 Schroeplerstrasse 35 Ingolstadt DEX), Protective housing made of a synthetic material to hold measuring, control, monitoring and similar devices in repeated u.
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Han Duk-Ho,KRX, Radiation apparatus and radiation method for integrated circuit semiconductor device and for portable computer.
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Baran Michael S. ; Cloran Shawn D., Terminal block supported printed circuit cards for compact programmable logic controller.
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Kormanyos, Kenneth R., Thin-film deposition and recirculation of a semi-conductor material.
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Petsch Johann (Poing DEX), Transistor control unit for a servo motor.
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Ayres John W. ; Byrne Vincent ; Fontana Edward C. ; Stein Steven C., Transverse mountable heat sink for use in an electronic device.
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Byrne Vincent ; Fontana Edward C. ; Sandage Ralph ; Zhang Joanne, Transverse mountable heat sink for use in an electronic device.
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Dodson Douglas A. (5995 Avenida Encinas Carlsbad CA 92008), Twin fan cooling device.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Electronic cooling chassis 원문보기

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이 특허를 인용한 특허 (51)

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Electronic cooling chassis 원문보기

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이 특허를 인용한 특허 (51)

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