초록 ▼

A method of heat and pressure bonding plates of heat conductive metal onto stainless steel bottom surfaces of containers by placing the plates of heat conductive metal of no greater area than the stainless steel surface to be covered into position on the stainless steel surface area, heating the ass

A method of heat and pressure bonding plates of heat conductive metal onto stainless steel bottom surfaces of containers by placing the plates of heat conductive metal of no greater area than the stainless steel surface to be covered into position on the stainless steel surface area, heating the assembly to near the fusion temperature of the heat conductive metal immediately whereafter while the assembly is still at said temperature applying bonding pressure to the assembly. During the pressure bonding, the perimeter of the heat conductive metal plate is confined against spreading to assure uniformity of pressure application and bonding efficiency throughout the laminar area of the assembly and to utilize a die cavity to confine an edge of the plate material thus maintaining the diameter of theedge of the plate.

대표청구항 ▼

A method of heat and pressure bonding a bottom plate of heat conductive metal onto the bottom surface of a stainless steel container having a peripheral wall of larger diameter than the bottom surface and a connecting surface sloping from the bottom surface to the peripheral wall, the method compris

A method of heat and pressure bonding a bottom plate of heat conductive metal onto the bottom surface of a stainless steel container having a peripheral wall of larger diameter than the bottom surface and a connecting surface sloping from the bottom surface to the peripheral wall, the method comprising: placing into laminar assembly with said bottom surface a plate of heat conductive metal of an original diameter substantially the same as the diameter of said bottom surface and with the edge of the plate spaced from the diameter of said peripheral wall by substantially the width of said connecting surface; heating the assembly to nearly the fusion temperature of the heat conductive metal of said plate; while the assembly is at said temperature applying bonding pressure uniformly over the full area of the plate to effect fusion bonding of the plate to said bottom surface; closely confining the perimeter of the plate for firmly retaining the edge substantially against spreading from its original diameter and holding said plate and said bottom surface against relative displacement while applying said bonding pressure whereby to assure uniformity of pressure and bonding of the plate throughout its area to said bottom surface.