이 특허를 인용한 특허 (70)

1. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.

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2. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.

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3. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device and method of making same.

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4. Rosenfeld, John H.; Minnerly, Kenneth G., Capillary assisted loop thermosiphon apparatus.

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5. Rosenfeld, John H.; Minnerly, Kenneth G., Capillary assisted loop thermosiphon apparatus.

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6. Schwartz, David Eric; Rao, Ranjeet Balakrishna, Co-extruded microchannel heat pipes.

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7. Schwartz, David Eric; Rao, Ranjeet Balakrishna, Co-extruded microchannel heat pipes.

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8. Tanaka Hiroshi,JPX ; Kobayashi Kazuo,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Matsumoto Tatsuhito,JPX, Cooling apparatus by boiling and cooling refrigerant.

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9. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.

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10. Dietzsch Claudius R. (Stein am Rhein CHX), Device for transferring heat energy by capillary forces.

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11. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporator employing a liquid superheat tolerant wick.

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12. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Evaporator for a heat transfer system.

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13. Khrustalev, Dmitry; Cologer, Pete; Garzon, Jessica Maria; Stouffer, Charles; Feenan, Dave; Baker, Jeff; Beres, Matthew C., Evaporator for use in a heat transfer system.

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14. Kroliczek, Edward J.; Khrustalev, Dmitry; Morgan, Michael J., Evaporator including a wick for use in a two-phase heat transfer system.

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15. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Evaporators for heat transfer systems.

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16. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.

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17. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.

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18. Cho, Kyung-il; Cho, Hye-jung; Lee, Jae-yong; Song, In-seob, Flat evaporator.

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19. Jin-Cherng, Shyu; Che-Wei, Lin; Lan-Kai, Yeh; Ming-Jye, Tsai; Shao-Wen, Chen; Cheng-Tai, Chung, Flat heat pipe provided with means to enhance heat transfer thereof.

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20. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.

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21. Masaaki Yamamoto JP; Jun Niekawa JP; Yuichi Kimura JP; Kenichi Namba JP, Flat type heat pipe.

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22. Kim, Hae-Soo, Heat dissipating apparatus and electronic device having the same.

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23. Yeh, Lan Kai; Lin, Che Wei; Tsai, Ming Jye; Chen, Shao Wen; Shyu, Jin Cherng, Heat dissipating apparatus having micro-structure layer and method of fabricating the same.

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24. Yeh,Lan Kai; Lin,Che Wei; Tsai,Ming Jye; Chen,Shao Wen; Shyu,Jin Cherng, Heat dissipating apparatus having micro-structure layer and method of fabricating the same.

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25. Cirrito Vincent (Massapequa Park NY) Koubek Kevin J. (South Setauket NY) Quadrini John A. (Northport NY), Heat pipe cooled electronic circuit card.

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26. Kawahara,Youji; Mochizuki,Masataka; Mashiko,Koichi; Kiyooka,Fumitoshi; Agata,Hiroaki, Heat pipe excellent in reflux characteristic.

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27. Lewis, Wallace J.; Bolser, David R., Heat pipe fabrication.

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28. Zuo, Jon; Ernst, Donald M., Heat pipe having a wick structure containing phase change materials.

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29. Liu, Yue; Liu, Jin-Peng; Dai, Sheng-Liang; Wu, Sheng-Lin; Lo, Yu-Liang, Heat pipe including a sealing member.

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30. Wang, Shih-Ming; Liao, Pang-Hung; Wang, Cheng-Tu, Heat plate structure.

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31. Schulz-Harder, Jürgen, Heat sink in the form of a heat pipe and process for manufacturing such a heat sink.

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32. Rosenfeld,John H.; Ernst,Donald M., Heat transfer device and method of making same.

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33. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, David A., Heat transfer system.

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34. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Heat transfer system.

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35. Dussinger Peter M. ; Myers Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.

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36. Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.

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37. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.

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38. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.

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39. Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.

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40. Dussinger,Peter M.; Myers,Thomas L.; Rosenfeld,John H.; Minnerly,Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.

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41. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.

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42. Edward J. Kroliczek ; Kimberly R. Wrenn ; David A. Wolf, Sr., Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction.

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43. Kroliczek,Edward J.; Yun,James Seokgeun; Nikitkin,Michael; Wolf, Sr.,David A., Manufacture of a heat transfer system.

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44. Bozzano, Andrea G.; Bradley, Steven A.; Castillo, Ricardo L.; Chen, John Q., Methanol-to-olefins process with reduced coking.

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45. Akutsu Shoji,JPX, Method of checking whether noncondensable gases remain in heat pipe and process for producing heat pipe.

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46. Yeh, Lan-Kai; Lin, Che-Wei; Tsai, Ming-Jye; Chen, Shao-Wen; Shyu, Jin-Cherng, Method of fabricating heat dissipating apparatus.

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47. Yang, Hsiu-Wei, Method of manufacturing heat dissipation device.

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48. Ponnappan Rengasamy ; Leland John E., Micro channel heat pipe having wire cloth wick and method of fabrication.

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49. Wang, Yaxiong; Huang, Chung-Yuan, Micro grooved heat pipe.

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50. Zheng, Wen-Chun, Nearly isothermal heat pipe heat sink.

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51. Joshi, Yogendra; Murthy, Sunil S.; Nakayama, Wataru, Orientation-independent thermosyphon heat spreader.

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52. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Ueki Tatsuhiko,JPX ; Sasaki Ken,JPX, Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe.

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53. Nagai, Hiroyuki; Ryoson, Hiroyuki, Plate-type heat transport device and electronic instrument.

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54. Chin, Chi-Te, Quick temperature-equlizing heat-dissipating device.

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55. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.

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56. Garner,Scott D.; Lindemuth,James E.; Toth,Jerome E.; Rosenfeld,John H.; Minnerly,Kenneth G., Sintered grooved wick with particle web.

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57. Wang,Chin Wen; Wang,Pei Choa; Wang,Ching Chung, Structure of heat conductive plate.

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58. Wang, Chin-Wen; Wang, Ching Chung; Wang, Pei-Choa, Tabular heat pipe structure having support bodies.

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59. Basavanhally, Nagesh R.; Hodes, Marc Scott; Kolodner, Paul Robert; Kornblit, Avinoam; Krupenkin, Thomas Nikita; Lee, Wonsuck; Lyons, Alan Michael; Salamon, Todd Richard; Vyas, Brijesh, Thermal energy transfer device.

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60. Kroliczek, Edward J.; Yun, James; Bugby, David; Wolf, Sr., David A., Thermal management system.

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61. Kroliczek, Edward J.; Yun, James S.; Bugby, David C.; Wolf, Sr., David A., Thermal management systems.

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62. Kroliczek, Edward J.; Yun, James Soekgeun; Bugby, David C.; Wolf, Sr., David A., Thermal management systems including venting systems.

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63. Kroliczek, Edward J.; Nikitkin, Michael; Wolf, Sr., David A., Thermodynamic system including a heat transfer system having an evaporator and a condenser.

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64. Thomas Daniel Lee, Thin planar heat spreader.

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65. Thomas Daniel Lee, Thin, planar heat spreader.

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66. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.

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67. Kroliczek, Edward J.; Khrustalev, Dmitry; Morgan, Michael J., Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems.

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68. Lindemuth, James E.; Rosenfeld, John H., Vapor chamber with sintered grooved wick.

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69. Lindemuth,James E.; Rosenfeld,John H., Vapor chamber with sintered grooved wick.

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70. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.

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