[특허]Transistor cooling by heat pipes having a wick of dielectric powder

Transistor cooling by heat pipes having a wick of dielectric powder 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/02 H01L-025/04
출원번호	US-0678336 (1976-04-19)
발명자 / 주소	Sekhon Kalwant S. (Fullerton CA) Nelson Lloyd A. (Villa Park CA) Fritz Jr. John E. (Anaheim CA)
출원인 / 주소	Hughes Aircraft Company (Culver City CA 02)
인용정보	피인용 횟수 : 42 인용 특허 : 0

초록 ▼

A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.

대표청구항 ▼

A microelectronic package capable of operating with power densities extending at least to 10 kW/cm2 comprising: means for defining a sealed enclosure coupled to an external heat sink; means for defining electronic devices and circuitry sealed within said enclosure means; electrical coupling means from said electronic devices and circuitry means and extending outside of said enclosure means for electrically coupling said electronic devices and circuitry means to further electronic circuits; means including dielectric powder adhered substantially to all interior surfaces of said enclosure means and to all exposed surfaces of said electronic devices and circuitry means for defining a heat pipe wick substantially completely and conformally coating said interior and exposed surfaces; and means for defining a dielectric working fluid in said enclosure means and intimately contactable with all said interior and exposed surfaces, thereby for minimizing the occurrence of local hot spots on said electric devices and circuitry means and for maximizing heat transfer therefrom to said external heat sink.

이 특허를 인용한 특허 (42)

Kelsey Shannon J. ; Salzman Philip M., Ceramic dome temperature control using heat pipe structure and method.
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Schwartz, David Eric; Rao, Ranjeet Balakrishna, Co-extruded microchannel heat pipes.
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Schwartz, David Eric; Rao, Ranjeet Balakrishna, Co-extruded microchannel heat pipes.
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Weber, Richard M.; Rummel, Kerrin A., Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media.
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Pal, Debabrata, Controller cooling arrangement.
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Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
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Harold K. Haavik, Cooling gas in a rotary screw type pump.
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DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J., Direct chip-cooling through liquid vaporization heat exchange.
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Groover Richard L. (Santa Clara CA) Shu William K. (Sunnyvale CA) Lee Sang S. (Sunnyvale CA) Fujimoto George (Santa Clara CA), Electrically and thermally enhanced package using a separate silicon substrate.
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Hamburgen William R. (Menlo Park CA), Evaporator having etched fiber nucleation sites and method of fabricating same.
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Xie Hong, Heat pipe lid for electronic packages.
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Anderl, William J.; Elison, Bret P.; Mann, Phillip V., Heat sink with integrated threaded lid.
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Luo, Chin-Kuang; Kuo, Chin-Liang, Heat-transfer device.
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Saaski Elric (Kirkland WA) Hannemann Robert J. (Wellesley MA) Fox Leslie R. (Acton MA), Integral heat pipe module.
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Lai, Yaw-Huey, Integrated circuit chip cooling structure with vertical mounting through holes.
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Dussinger Peter M. ; Myers Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Dussinger,Peter M.; Myers,Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Dussinger,Peter M.; Myers,Thomas L.; Rosenfeld,John H.; Minnerly,Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
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Sliwa ; Jr. John W. (Stanford CA), Integrated circuit micropackaging.
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Elias,J. Michael; Cepas,Bruce M.; Korn,James A., Integrated power and cooling architecture.
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L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
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Johnston, David W.; Zaslavsky, Gregory; Serre, Jeffery J., LED light source having glass heat pipe with fiberglass wick.
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Fitch John Stuart ; Hamburgen William Riis, Lap-top enclosure having surface coated with heat-absorbing phase-change material.
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Elias, J. Michael; Cepas, Bruce M., Method and apparatus for absorbing thermal energy.
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Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
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Haws,James L.; Short, Jr.,Byron Elliott, Method and apparatus for cooling with a phase change material and heat pipes.
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Ehret,Timothy; Smith,Bradley M., Method of making a heat pipe.
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Ponnappan Rengasamy ; Leland John E., Micro channel heat pipe having wire cloth wick and method of fabrication.
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Ehret, Timothy; Smith, Bradley M., Molded or encapsulated transmit-receive module or TR module/antenna element for active array.
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Tsai, Tsung-Yueh; Peng, Sheng-Yang, Package structure compatible with cooling system.
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Rightley, Michael J.; Adkins, Douglas R.; Mulhall, James J.; Robino, Charles V.; Reece, Mark; Smith, Paul M.; Tigges, Chris P., Parallel-plate heat pipe apparatus having a shaped wick structure.
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Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Ueki Tatsuhiko,JPX ; Sasaki Ken,JPX, Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe.
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Oberlin,Gary E.; Myers,Bruce A.; Degenkolb,Thomas A.; Peugh,Darrel E., Power electronic system with passive cooling.
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Li Chou H. (379 Elm Dr. Roslyn NY 11576), Temperature controlled apparatus.
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Weber,Richard M.; Chen,Kevin W., Thermal management system having porous fluid transfer element.
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Thomas Daniel Lee, Thin planar heat spreader.
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Pal, Debabrata, Two-phase electronic component cooling arrangement.
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Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Wicking and coupling element(s) facilitating evaporative cooling of component(s).
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Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Wicking and coupling element(s) facilitating evaporative cooling of component(s).
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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Transistor cooling by heat pipes having a wick of dielectric powder 원문보기

초록 ▼

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Transistor cooling by heat pipes having a wick of dielectric powder 원문보기

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이 특허를 인용한 특허 (42)

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