|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||165/35 ; 165/104S ; 165/105 ; 343/705|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 21 인용 특허 : 0|
A streamlined electronic-component-containing pod is mounted on the exterior of a military aircraft in subjection to the airflow past the aircraft during flight. An evaporator in the pod is close coupled thermally to the electronic components for cooling. The outer skin of the pod acts as a condenser for return of liquid refrigerant to the evaporator during normal flight operations. During short-term high-speed dash operation the outer skin of the pod becomes too hot for condensing refrigerant vapor, which then becomes condensed by a heat sink. At this t...
An airborne assembly comprising, a pod for mounting on the exterior of an aircraft in subjection to air flow past the aircraft during flight, heat creating electronic components disposed within said pod, p1 evaporative cooling fluid disposed within said pod, p1 vertically extending evaporator means within said pod in close thermal coupling with said electronic components and having bottom inlet for said cooling fluid in liquid state and an upper exit for said cooling fluid in vapor state, a first condenser means for the cooling fluid vapor from said evap...