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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Electrical package for LSI devices and assembly process therefor

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-001/04   
미국특허분류(USC) 361/411 ; 29/830 ; 29/831 ; 257/717 ; 257/720 ; 257/747
출원번호 US-0534967 (1974-12-20)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Redmond, Jr., Joseph C.
인용정보 피인용 횟수 : 274  인용 특허 : 1
초록
▼

An electrical package for Large Scale Integrated (LSI) devices includes a carrier having (a) thermal expansion similar to a semiconductor, (b) a standard array of terminal pins (100 or more) and (c) a circuit transposer that is (i) a semiconductor material, typically silicon and (ii) readily personalized to connect any combination of attached LSI devices to the input-output terminal pins. The package utilizes solder technology to interconnect the carrier, circuit transposer and LSI devices. The carrier and semiconductor transposer eliminate mechanical st...

대표청구항이 없습니다

이 특허에 인용된 특허 (1)

  1. Davidson Lewis A. (Reston VA) Duffy Michael C. (Vienna VA) Erickson Alvard J. (Reston VA) Gunther-Mohr Gerard R. (Chappaqua NY) Williams Richard A. (Candor NY). Functional package for complex electronic systems with polymer-metal laminates and thermal transposer. USP1976043952231.

이 특허를 인용한 특허 피인용횟수: 274

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