이 특허를 인용한 특허 (53)

1. Inubushi, Yasutaka; Hori, Takashi; Kurihara, Toyoaki; Ogi, Hiroyuki, Adsorbent.

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2. Imamura, Takashi; Kameyama, Nobuyuki, Battery unit for lens-fitted photo film unit.

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3. Ihab M. Hekal, Co-continuous interconnecting channel morphology composition.

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4. Ihab M. Hekal, Co-continuous interconnecting channel morphology polymer having controlled gas transmission rate through the polymer.

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5. Hekal, Ihab M., Co-continuous interconnecting channel morphology polymer having modified surface properties.

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6. Bonucci, Antonio; Rondena, Sergio; Cattaneo, Lorena, Composite H2O absorber for sealed medical devices.

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7. Anderson James E. (Ann Arbor MI) Markovac Vlado (Lathrup Village MI) Troyk Philip R. (Morton Grove IL), Composite polymer/desiccant coatings for IC encapsulation.

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8. Anderson James E. (Ann Arbor MI) Markovac Vlado (Lathrup Village MI) Troyk Philip R. (Morton Grove IL), Composite polymer/desiccant coatings for IC encapsulation.

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9. Vacca, Paolo; Bonucci, Antonio; Rondena, Sergio; Macchi, Roberto, Composition for the protection of moisture sensitive devices.

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10. Merical, Rick; Wurtzel, Kenneth C.; Murray, Lee, Containers intended for moisture-sensitive products.

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11. Merical, Rick; Wurtzel, Kenneth Charles; Murray, Lee, Containers intended for moisture-sensitive products.

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12. Hekal Ihab M., Desiccant entrained polymer.

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13. Hekal Ihab M., Desiccant entrained polymer.

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14. Hekal Ihab M., Desiccant entrained polymer.

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15. Boroson,Michael L., Desiccant for top-emitting OLED.

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16. Boroson, Michael L.; Hamer, John W., Desiccant sealing arrangement for OLED devices.

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17. Cok, Ronald S.; Boroson, Michael L.; O'Toole, Terrence R., Desiccant structures for OLED displays.

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18. Boroson, Michael L.; Serbicki, Jeffrey P.; Bessey, Peter G.; Irvin, Glen C.; Rowley, Lawrence A.; Kaminsky, Cheryl J., Desiccants and desiccant packages for highly moisture-sensitive electronic devices.

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19. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.

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20. Hekal Ihab M., Dessicant entrained polymer.

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21. Davis ; Jr. John A. (Santa Barbara CA) Peck Leonard E. (Goleta CA) Sargent Wesson P. (Goleta CA) Rich Benjamin K. (Santa Barbara CA), Dewar cryopumping using molecular sieve.

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22. Kolczyk, Markus, Drying agent box.

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23. Tester,Theodore R.; Debrody,Robert F.; Ruth,Donald A., Electronic security seal.

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24. Merical, Rick; Murray, Lee; Sikorsky, James, Films having a desiccant material incorporated therein and methods of use and manufacture.

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25. Vescovi, Chiara; Cattaneo, Lorena; Giannantonio, Roberto; Longoni, Giorgio, Gas sorbing composite systems and methods for their manufacturing.

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26. Giannantonio, Roberto; Longoni, Giorgio; Vescovi, Chiara; Cattaneo, Lorena, Getter systems comprising a gas-sorbing phase in the pores of a porous material distributed in a permeable means.

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27. Giannantonio, Roberto; Longoni, Giorgio; Vescovi, Chiara; Cattaneo, Lorena, Getter systems comprising an active phase inserted in a porous material distributed in a low permeability means.

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28. Boroson, Michael L.; Schmittendorf, John; Serbicki, Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication.

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29. Boroson,Michael L.; Schmittendorf,John; Serbicki,Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication.

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30. Boroson, Michael L.; Schmittendorf, John; Bessey, Peter G.; Serbicki, Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.

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31. Michael L. Boroson ; John Schmittendorf ; Peter G. Bessey ; Jeffrey P. Serbicki, Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.

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32. Uchibori, Teruo; Ohyama, Kaneto; Miyazawa, Kentaro; Kawaguchi, Yohei; Maki, Hidehiko; Nakajima, Yusuke, Hygroscopic molding.

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33. Ihab M. Hekal, Insert having interconnecting channel morphology for aldehyde absorption.

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34. Seo, Satoshi, Light emitting device.

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35. Banfield Charles E. (Nashua NH), Method and compositions for removal of moisture.

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36. Cok, Ronald S.; Boroson, Michael L.; O'Toole, Terrence R., Method of manufacturing a top-emitting OLED display device with desiccant structures.

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37. Hekal Ihab M., Modified polymers having controlled transmission rates.

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38. Hekal Ihab M., Modified polymers having controlled transmission rates.

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39. Shores A. Andrew (Venice CA), Moisture getting composition for hermetic microelectronic devices.

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40. Ricks, Michele L.; Boroson, Michael L., Moisture protection for OLED display.

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41. Cernohous, Jeffrey Jacob; Granlund, Neil R., Moisture scavenger composition.

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42. Hekal Ihab M., Monolithic composition having an activation material.

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43. Hekal Ihab M., Monolithic polymer composition having a releasing material.

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44. Hekal, Ihab, Monolithic polymer composition having a releasing material.

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45. Hekal Ihab M. ; Langer Robert S. ; Klibanov Alexander M. ; Mathiowitz Edith, Monolithic polymer composition having a water absorption material.

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46. Hekal Ihab M., Monolithic polymer composition having an absorbing material.

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47. Nabors Lester G. (Stow OH), Polyester blends comprising a desiccant and a rubbery block copolymer.

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48. Nabors, Lester G., Polyester blends containing a metal oxide desiccant.

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49. Cao, Jie; Herr, Donald E., Radiation-curable desiccant-filled adhesive/sealant.

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50. Breidenthal, Scott S.; Kacian, Daniel L.; Lee, Richard S.; Nelson, Norman C.; Scott, Matthew J.; Taylor, Jason A., Receptacles for storing substances in different physical states.

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51. Daniel-Ivad, Josef, Rechargeable alkaline manganese cell with cathode consistency compensation.

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52. Boroson, Michael L.; Schmittendorf, John; Bessey, Peter G.; Serbicki, Jeffrey P., Sealing structure for highly moisture-sensitive electronic device element and method for fabrication.

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53. Wakelin,Suzanne, System and method for gettering gas-phase contaminants within a sealed enclosure.

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