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Circuit for the recovery of solvent vapor evolved in the course of a cleaning cycle in dry-cleaning machines or plants, 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • D06F-043/08
출원번호 US-0769849 (1977-02-17)
우선권정보 IT-0003429 (1976-05-14); IT-0003575 (1976-11-02)
발명자 / 주소
  • Zucchini
  • Guido
출원인 / 주소
  • AMA Universal S.p.A.
대리인 / 주소
    Browdy and Neimark
인용정보 피인용 횟수 : 40  인용 특허 : 1

초록

Recovery of solvent vapor in the course of the cleaning cycle in dry-cleaning machines and/or plants, which include a cleaning circuit, a drying circuit and a distillation circuit, in which low boiling-point solvents are utilized in particular, and simultaneous de-pressurization of such machines, in

대표청구항

대표청구항이 없습니다.

이 특허에 인용된 특허 (1)

  1. Hughes John D. (Murrysville PA) Klingensmith Al W. (Mansfred OH), Vapor saving ambient air intake system for a dry cleaner.

이 특허를 인용한 특허 (40)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  4. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  5. Suissa Moshe (5561 Alpine Cte St Luc ; Quebec CAX H4V 2X4), Dry cleaning machine.
  6. Naber, Christopher Nils; Vitan, Craig; Rachakonda, Venkataraman; Hallman, Darren, Dry cleaning solvent filter.
  7. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  8. Jones, William D., High pressure fourier transform infrared cell.
  9. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  10. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  11. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  12. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  13. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  14. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  15. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  16. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  17. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  18. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  19. Coindreau-Palau Damaso (Bosques de Chapultepec 104 Col. Bosques Del Valle Monterrey ; Nuevo Leon MXX), Method and system for the recovering of solvents in dry cleaning machines.
  20. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  21. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  22. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  23. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  24. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  25. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  26. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  27. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  28. Wuester,Christopher D., Process flow thermocouple.
  29. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  30. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  31. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  32. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  33. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  34. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  35. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  36. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  37. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  38. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  39. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  40. Yamada Yukio,JPX, Wet cleaning system with shrinkage prevention agent.
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