A system for cooling high density integrated circuits for computer systems comprising a cooling frame having a plurality of the heat pipes spanning the space within the frame to which sub-islands are attached to form an island. Each sub-island comprises a printed circuit board on which are mounted connectors for mounting the integrated circuit package and printed circuit board heat sinks having posts which cooperate with hold down pressure clamps for clamping the integrated circuit packages into the connectors and to clamp the heat sink plates of the int...
이 특허를 인용한 특허 피인용횟수: 11
- Bartilson, Bradley W.; Jirak, James J.. Air distribution system and manifold for cooling electronic components. USP1994065321581.
- Ishimine Junichi,JPX ; Suzuki Masahiro,JPX. Air-cooled electronic apparatus. USP2000106137682.
- Aoki, Russell S.; Crocker, Michael T.; Carter, Daniel P.. Chamber sealing valve. USP2010117836748.
- Aoki,Russell S.; Crocker,Michael T.; Carter,Daniel P.. Chamber sealing valve. USP2008097418998.
- DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J.. Direct chip-cooling through liquid vaporization heat exchange. USP2000076085831.
- Singh, Brij N.; Roan, Thomas; Wieland, Andrew D.; Clements, Neal D.. Electronic assembly with one or more heat sinks. USP2017069693488.
- Cipolla Thomas Mario ; Coteus Paul William ; Mok Lawrence Shungwei. Hinge incorporating a helically coiled heat pipe for a laptop computer. USP1999065910883.
- Smith, Stephen W.; Creek, William R.. Integrated micromachine relay for automated test equipment applications. USP2005066903562.
- Smith, Stephen W.; Creek, William R.. Integrated micromachine relay for automated test equipment applications. USP2004036700396.
- Artman, Paul T.; Tunks, Eric. Multiple heat pipe heat sink. USP2004086785140.
- Yamazaki, Shunpei; Miyanaga, Akiharu; Koyama, Jun; Fukunaga, Takeshi. Thin film semiconductor device and its manufacturing method. USP2010107812351.