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Fluid cooling systems for electronic systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-021/00
  • F28F-007/00
출원번호 US-0778308 (1977-03-16)
발명자 / 주소
  • Wilson
  • Edward A.
  • Fredenberg
  • James D.
출원인 / 주소
  • Honeywell Information Systems, Inc.
대리인 / 주소
    Hughes, Edward W.Holloway, Jr., William W.Reiling, Ronald T.
인용정보 피인용 횟수 : 100  인용 특허 : 0

초록

A fluid cooling system for electronic systems particularly adapted to cool large scale integrated circuit chips mounted on substrates. The system has one or more heat exchangers through which a liquid coolant is circulated. Each heat exchanger has a flexible wall and is mounted so that its flexible

대표청구항

대표청구항이 없습니다.

이 특허를 인용한 특허 (100)

  1. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
  2. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
  3. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
  4. Cutchaw John M. (7333 E. Virginia Ave. Scottsdale AZ 85257), Apparatus for cooling high-density integrated circuit packages.
  5. Cutchaw John M. (7333 E. Virginia Ave. Scottsdale AZ 85257), Apparatus for cooling high-density integrated circuit packages.
  6. Seidler, Siegfried; Angelis, Walter G.; Laufer, Wolfgang; Lulic, Francisco Rojo, Apparatus including a heat exchanger and equalizing vessel.
  7. Datta, Madhav; McMaster, Mark, Bonded metal and ceramic plates for thermal management of optical and electronic devices.
  8. Robinson, Stanley, Carbon-based apparatus for cooling of electronic devices.
  9. Tsuji Mutsuo (Tokyo JPX), Chip carrier.
  10. Marsala, Joseph, Cold plate utilizing fin with evaporating refrigerant.
  11. Vafai, Kambiz; Khaled, Abdul-Rahim Assaad, Control of flow rate and thermal conditions using two-layered thin films separated by flexible seals and rotatable pivot.
  12. Edelmann, Achim, Cooling device.
  13. Haussmann, Roland, Cooling device and vehicle battery assembly.
  14. Haussmann, Roland, Cooling device and vehicle battery assembly.
  15. Haussmann, Roland, Cooling device for a vehicle battery, and vehicle battery with cooling device.
  16. Haussmann, Roland, Cooling device for a vehicle battery, and vehicle battery with cooling device.
  17. Vafai, Kambiz; Khaled, Abdul Rahim A., Cooling enhancements in thin films using flexible complex seal due to temperature increase or thermal load increase.
  18. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Iruma JPX) Masaki Akira (Meguro JPX) Imai Kuninori (Shiroyama JPX) Chiba Katuaki (Kokubunji JPX), Cooling module for integrated circuit chips.
  19. Yamada, Minoru; Masaki, Akira; Yamamoto, Masakazu; Nakanishi, Keiichirou; Nishida, Takashi; Daikoku, Takahiro; Kobayashi, Fumiyuki; Imai, Kuninori, Cooling module for integrated circuit chips.
  20. Sano Toshifumi (Tokyo JPX), Cooling structure.
  21. Mine Shinji (Tokyo JPX) Shimonishi Terumi (Tokyo JPX), Cooling structure for heat generating electronic components mounted on a substrate.
  22. Mizuno Tsukasa (Tokyo JPX), Cooling system.
  23. St.ang.hl Lennart ; Wallace ; Jr. John Francis ; Parraz John Carlenas ; Clark Montford Henry ; Winn David, Cooling system and method for distributing cooled air.
  24. Umezawa, Kazuhiko, Cooling system for IC package.
  25. Eriksen, André Sloth, Cooling system for a computer system.
  26. Eriksen, André Sloth, Cooling system for a computer system.
  27. Eriksen, André Sloth, Cooling system for a computer system.
  28. Eriksen, André Sloth, Cooling system for a computer system.
  29. Mine Shinji (Tokyo JPX), Cooling system for three-dimensional IC package.
  30. Kenny, Thomas W.; Munch, Mark; Zhou, Peng; Shook, James Gill; Goodson, Kenneth; Corbin, Dave; McMaster, Mark; Lovette, James, Cooling systems incorporating heat exchangers and thermoelectric layers.
  31. Umezawa Kazuhiko (Tokyo JPX), Cooling unit.
  32. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
  33. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  34. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  35. Shuff Gregg Douglas, Electrical circuit cooling device.
  36. Tozuka Tadao,JPX ; Suzuki Kozo,JPX, Electronic cooling apparatus.
  37. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Simons,Robert E.; Schmidt,Roger R., Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins.
  38. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
  39. Vafai, Kambiz; Khaled, Abdul-Rahim Assaad, Enhancing insulating properties at higher temperature utilizing soft seals.
  40. Denny, Ronald R.; Kowalski, Bobby Jim; Seward, James T.; Ebsen, Michael P.; Rosenthal, Thomas; Leinberger, William J.; Young, Jeffery Stagg; Josephson, Andrew D., Expandable fluid cooling structure.
  41. Hartzell, Dennis E.; Oleksy, John; Ognibene, Edward J.; Breaux, Lyle, Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same.
  42. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
  43. Flint Ephraim B. (Garrison NY) Grebe Kurt R. (Beacon NY) Gruber Peter A. (Mohegan Lake NY) Zingher Arthur R. (White Plains NY), Flexible finned heat exchanger.
  44. Betker Jay B. (Fullerton CA), Flexible membrane heat sink.
  45. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
  46. Niggemann Richard E. (Rockford IL), Heat exchanger.
  47. Burward-Hoy Trevor, Heat exchanger for electronic equipment.
  48. Werner,Douglas; Munch,Mark; Kenny,Thomas, Hermetic closed loop fluid system.
  49. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  50. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
  51. Smith, Stephen W.; Creek, William R., Integrated micromachine relay for automated test equipment applications.
  52. Smith, Stephen W.; Creek, William R., Integrated micromachine relay for automated test equipment applications.
  53. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
  54. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  55. Bezama, Raschid J.; Long, David C.; Natarajan, Govindarajan; Weiss, Thomas, Liquid cooled compliant heat sink and related method.
  56. Bezama, Raschid J.; Long, David C.; Natarajan, Govindarajan; Weiss, Thomas, Liquid cooled compliant heat sink and related method.
  57. Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  58. Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
  59. Kuramitsu Yuji (Tokyo JPX) Yamaguchi Yukio (Tokyo JPX), Liquid cooling system for integrated circuit chips.
  60. Brzezinski Dennis (Sunnyvale CA), Mechanically floating multi-chip substrate.
  61. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
  62. Holmberg Ulf I.,SEX ; Gudmundsson Bjorn,SEX, Method and apparatus for arranging heat transport.
  63. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
  64. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
  65. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,David, Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device.
  66. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  67. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
  68. Vafai, Kambiz; Khaled, Abdul Rahim A., Methods and devices comprising flexible seals for modulating or controlling flow and heat.
  69. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
  70. Fuesser Hans-Juergen,DEX ; Zachai Reinhard,DEX ; Muench Wolfram,DEX ; Gutheit Tim,DEX, Microcooling device and method of making it.
  71. Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
  72. Vafai, Kambiz; Khaled, Abdul Rahim A., Minimizing flow disturbances in fluidic cells utilizing soft seals.
  73. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
  74. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
  75. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
  76. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
  77. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  78. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  79. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  80. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  81. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  82. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  83. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  84. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  85. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  86. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
  87. Nicol Edward A. (San Diego CA) Adrian George J. (San Diego CA), Self-aligning liquid-cooling assembly.
  88. Chen, Chin-Ping, Semi-closed air cooling type radiator.
  89. Vafai, Kambiz; Khaled, Abdul Rahim Assaad, Smart passive thermal devices and methods.
  90. Umezawa Kazuhiko (Tokyo JPX), Structure for temperature detection in a package.
  91. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  92. Kowalski, Bobby Jim; Denny, Ronald R.; Seward, James T.; Ebsen, Michael P.; Rosenthal, Thomas; Leinberger, William J.; Josephson, Andrew D.; Young, Jeffery Stagg, System and method for interconnecting circuit boards.
  93. Vafai, Kambiz; Khaled, Abdul Rahim Assaad, Thin film based microfluidic devices.
  94. Adamski Joseph R. (Brighton MA) Bowen Robert F. (Burlington MA), Tubular heat exchanger.
  95. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  96. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
  97. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
  98. Bezama Raschid J. ; Sherif Raed A., Variable thermal exchanger and method thereof.
  99. Skrzypchak, Mark J.; French, Michael J.; Remmers, Gregry M.; Koerner, Scott A.; Bylsma, Philip J.; Tanner, Mike A.; Wiegele, Dale A., Water-cooled engine control.
  100. Skrzypchak, Mark J.; French, Michael J.; Remmers, Gregry M.; Koerner, Scott A.; Bylsma, Philip J.; Tanner, Mike A.; Wiegele, Dale A., Water-cooled engine control.
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