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Glass composition for passivating semiconductor surfaces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C03C-003/04
출원번호 US-0678445 (1976-04-19)
우선권정보 DE-2517743 (1975-04-22)
발명자 / 주소
  • Muller Gerd (Mainz-Weisenau DEX)
출원인 / 주소
  • Jenaer Glaswerk Schott & Gen. (Mainz DEX 03)
인용정보 피인용 횟수 : 26  인용 특허 : 1

초록

Glass compositions useful for passivating silicon semiconductor elements or bodies and to semiconductor elements or bodies coated by such glass compositions. The glass compositions are applied onto the surface of the semiconductor in the form of a finely ground powder and thereafter fused on at leas

대표청구항

Glass compositions useful for passivating silicon semiconductor elements which are applied on the surface of said semiconductor in the form of a finely ground powder and thereafter fused on at least a portion of said semiconductor element without any gap, said composition comprising: (A) glass capab

이 특허에 인용된 특허 (1)

  1. Berkenblit Melvin (Yorktown Heights NY) Lussow Robert O. (Hopewell Junction NY) Reisman Arnold (Yorktown Heights NY), Glass composition.

이 특허를 인용한 특허 (26)

  1. Kawakami Keiichi (Yokohama JPX) Takabatake Mitsuo (Yokohama JPX) Chiba Jiro (Yokohama JPX), Composition for ceramic substrate and substrate.
  2. Kawakami Keiichi (Yokohama JPX) Takabatake Mitsuo (Yokohama JPX) Chiba Jiro (Yokohama JPX), Composition for ceramic substrate and substrate.
  3. Kellberg Howard E. (Corning NY), Devitrifying solder sealing glasses.
  4. Steinberg Jerry I. (Wilmington DE), Dielectric composition.
  5. Rellick Joseph R. (Wilmington DE), Dielectric compositions and method of forming a multilayer interconnection using same.
  6. Breymesser, Alexander; Brockmeier, Andre; Dielacher, Franz; Santos Rodriguez, Francisco Javier, Glass carrier with embedded semiconductor device and metal layers on the top surface.
  7. Furukawa, Kazuyoshi; Shimbo, Masaru; Fukuda, Kiyoshi; Tanzawa, Katsujirou, Glass composition for covering semiconductor element.
  8. Ohkura Yoshiyuki (Kawasaki JPX) Harada Hideki (Kawasaki JPX) Oshima Tadasi (Kawasaki JPX), Method for fabricating semiconductor device.
  9. Barringer Eric A. (Waltham MA) Lieberman Sheldon I. (Burlington MA) Schmidt Mark S. (West Newton MA) Hodge James D. (Medway MA), Method for producing materials for co-sintering.
  10. Corrie Brian L. (Gaston OR), Method of thinning a silicon wafer using a reinforcing material.
  11. Ushifusa Nobuyuki (Hitachi JPX) Ogihara Satoru (Hitachi JPX) Noro Takanobu (Yokohama JPX), Multilayered ceramic circuit board.
  12. Karlinski, Haggai; Fisher, Gil; Nathan, Roi; Weiss, Ilan, Print head with reduced bonding stress and method.
  13. Karlinski, Haggai; Fisher, Gil; Nathan, Roi; Weiss, Ilan, Print head with reduced bonding stress and method.
  14. Stevens Ralph E. (Merrimack NH) Perko Richard J. (Chelmsford MA) Gibson R. James (Chandler AZ), Process for producing a glass-coated article.
  15. Farnworth Warren M. ; Wood Alan G., Process of making a glass semiconductor package.
  16. Kokubu Yoshinori (Tokyo JPX) Chiba Jiro (Yokohama JPX) Ichimura Nobuyoshi (Yokohama JPX) Iwai Takashi (Yachiyo JPX) Kawaguchi Toshiyasu (Yokohama JPX), Sealing glass compositions.
  17. Arita Koji (Osaka JPX) Fujii Eiji (Ibaraki JPX) Shimada Yasuhiro (Mishima-gun JPX) Uemoto Yasuhiro (Otsu JPX) Nasu Toru (Kyoto JPX) Matsuda Akihiro (Suita JPX) Nagano Yoshihisa (Suita JPX) Inoue Atsu, Semiconductor device having capacitor and manufacturing method thereof.
  18. Arita Koji,JPX ; Fujii Eiji,JPX ; Shimada Yasuhiro,JPX ; Uemoto Yasuhiro,JPX ; Nasu Toru,JPX ; Matsuda Akihiro,JPX ; Nagano Yoshihisa,JPX ; Inoue Atsuo,JPX ; Matsuura Taketoshi,JPX ; Otsuki Tatsuo,JP, Semiconductor device having capacitor and manufacturing method thereof.
  19. Kasper Erich (Senden DEX) Weber Suso (Langenau DEX), Semiconductor-glass composite material and method for producing it.
  20. Tai Chao-Chih,TWX ; Jone El Pon,TWX ; Tsai Huei-Jeng,TWX, Silicon semiconductor rectifier chips and manufacturing method thereof.
  21. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  22. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  23. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  24. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  25. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  26. Parant Jean-Paul (Arpajon FRX), Vitreous material and semiconductor component incorporating same.
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