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Air cooling equipment for electronic systems 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0908612 (1978-05-23)
우선권정보 JP-0060627 (1977-05-24)
발명자 / 주소
  • Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX)
출원인 / 주소
  • Nippon Electric Co., Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 78  인용 특허 : 0

초록

An air cooling equipment for use in electronic systems of the type having a plurality of printed circuit wiring boards with a plurality of heat-generating electronic components mounted thereon is disclosed. The air cooling equipment uses a double-walled duct construction whereby air as a coolant is

대표청구항

Air cooling equipment having a plurality of printed circuit wiring boards with a plurality of heat-generating electronic components mounted thereon, said air cooling equipment comprising: a plurality of first covers of a “U”shape which cover said components on said printed circuit wiring boards and

이 특허를 인용한 특허 (78)

  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  2. Speraw Floyd G. (Lexington SC), Air cooling assembly in an electronic system enclosure.
  3. Kohmoto Mitsuo (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  4. Stuckert Paul E. (Katonah NY), Air jet powered cooling system for electronic assemblies.
  5. Daniel Fairchild Farmer ; Ashok Krishnamurthi ; Richard Singer ; Ali Mira, Apparatus and method for directing airflow in three dimensions to cool system components.
  6. Tambe, Atul, Apparatus for externally changing the direction of air flowing through electronic equipment.
  7. Tambe, Atul, Apparatus for externally changing the direction of air flowing through electronic equipment.
  8. Germagian, Mark; Prunier, John; Olsen, Martin, Assembly for extracting heat from a housing for electronic equipment.
  9. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  10. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  11. VanGilder, James W.; Germagian, Mark H., Cold aisle isolation.
  12. VanGilder, James W.; Germagian, Mark H., Cold aisle isolation.
  13. VanGilder, James W.; Germagian, Mark H., Cold aisle isolation.
  14. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  15. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  16. Archibald, Matthew R.; Buterbaugh, Jerrod K., Computer chassis cooling sidecar.
  17. Archibald, Matthew R.; Buterbaugh, Jerrod K., Computer chassis cooling sidecar.
  18. Miyahira,Frank, Computer equipment temperature control system and methods for operating the same.
  19. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  20. R. Stephen Spinazzola ; Dennis L. Peltz, Computer rack heat extraction device.
  21. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  22. Spinazzola, R. Stephen; Peltz, Dennis L., Computer rack heat extraction device.
  23. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  24. Spinazzola, R. Stephen; Peltz, Dennis L., Computer room air flow method and apparatus.
  25. Manahan, Joseph Michael; DeCarr, Graig E., Controlling airflow within an explosion-proof enclosure.
  26. Bell Melvyn R. (Crossgates GB6) Thomson Charles D. (Edinburgh GB6), Cooling means for circuit assemblies each including hollow structures spaced apart in a container.
  27. Sano Toshifumi (Tokyo JPX), Cooling structure.
  28. Mine Shinji (Tokyo JPX) Shimonishi Terumi (Tokyo JPX), Cooling structure for heat generating electronic components mounted on a substrate.
  29. Okuyama Katsuo (Kawasaki JPX) Arai Susumu (Machida JPX) Ishiwata Masao (Yokohama JPX) Takada Hirotoshi (Kawasaki JPX), Cooling structure of electronic equipment rack.
  30. Umezawa, Kazuhiko, Cooling system for IC package.
  31. Bishop, Jerry; Nesler, Clay, Cooling system for electronic equipment cabinets.
  32. Mine Shinji (Tokyo JPX), Cooling system for three-dimensional IC package.
  33. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  34. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  35. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  36. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  37. Umezawa Kazuhiko (Tokyo JPX), Cooling unit.
  38. Fink, James R.; Bean, John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  39. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  40. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  41. Fink,James R.; Bean, Jr.,John H.; Held,Stephen F.; Johnson,Richard J.; Johnson,Rollie R., Data center cooling.
  42. Fink, James, Data center cooling system.
  43. Miyamoto,Kenichi; Morishita,Yasuji; Katakura,Yasuyuki; Tanaka,Shigeaki; Kasahara,Yoshikatsu, Disk array apparatus.
  44. Archibald, Matthew R.; Buterbaugh, Jerrod K., Dynamically adjustable floor tile for a data center.
  45. Fujiya,Hiromitsu; Makabe,Eiji, Electronic apparatus.
  46. Yoshikawa Minoru,JPX, Electronic device cooling system having guides for guiding a flow of the air evenly.
  47. Sugiyama Akira,JPX ; Hoshino Tsutomu,JPX ; Yoshida Shinichi,JPX ; Joeng Tan Tjang,JPX, Electronic equipment.
  48. Carlson Douglas M. (Anoka MN) Ohman Randall L. (San Antonio TX) Thorndyke Lloyd M. (Edina MN), Electronic module cooling system using parallel air streams.
  49. Bolton, J. Stuart; Lee, Moohyung; Seki, Kenichi; Ido, Hiroto, Fan noise control apparatus.
  50. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
  51. Papst Georg (St. Georgen DEX) Wrobel Guenter (Villingen DEX) Koletzki Ulrich (St. Georgen DEX), Heat sink for electronic devices.
  52. Archibald, Matthew R.; Buterbaugh, Jerrod K., Hot or cold aisle computer chassis.
  53. Archibald, Matthew R.; Buterbaugh, Jerrod K., Individually cooling one or more computers in a rack of computers in a data center.
  54. Patel,Chandrakant D, Longitudinally cooled electronic assembly.
  55. Manahan, Joseph Michael; DeCarr, Graig E., Manifold for controlling airflow within an explosion-proof enclosure.
  56. Mok, Lawrence S., Method of constructing a multicomputer system.
  57. Archibald, Matthew R.; Buterbaugh, Jerrod K., Modeling movement of air under a floor of a data center.
  58. Cercioglu Nuri Murat ; Mottahed Behzad Davachi ; Kerr Claire Talkin, Modular design of electronic equipment systems.
  59. Okano Minoru (Tokyo JPX) Kohmoto Mitsuo (Tokyo JPX), Mounting structure for electronic circuit modules.
  60. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  61. Dodson Douglas A., Multiple fan cooling device.
  62. Smith Grant M., Parallel cooling of high power devices in a serially cooled evironment.
  63. Yanadori Michio (Hachioji JPX) Hosoda Yuji (Ibaraki JPX) Nakajima Isao (Ibaraki JPX) Igarashi Kenichi (Katsuta JPX) Kurosawa Makoto (Katsuta JPX) Hosoya Kensei (Ibaraki JPX) Kobayashi Tsuneki (Mito J, Printing apparatus with cooling of hammer printing coils.
  64. DeCarr, Graig E.; Barbuto, Samuel T.; Manahan, Joseph Michael, Programmable temperature controller for hazardous location enclosures.
  65. Germagian,Mark; VanGilder,James; Dudek,Jason, Rack height cooling.
  66. Germagian,Mark; VanGilder,James; Dudek,Jason, Rack height cooling.
  67. Johnson, Richard J.; Pfleging, Robert C.; Anderson, Timothy J.; Kroupa, Daniel C., Rack-mounted equipment cooling.
  68. Kieda Shigekazu (Ishioka JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Sato Motohiro (Ibaraki JPX), Semiconductor cooling device.
  69. Takahashi Yoshihiro (Kawasaki JPX) Okuyama Katsuo (Kawasaki JPX) Matsukuma Yutaka (Hatano JPX), Shelf unit for electronic communication devices.
  70. Beitelmal,Abdlmonem H.; Patel,Chandrakant D.; Bash,Cullen E., Small form factor air jet cooling system.
  71. Gates ; Jr. Louis E. (Westlake Village CA) Finnila Charles A. (Manhattan Beach CA), Stacked wafer electronic package.
  72. Umezawa Kazuhiko (Tokyo JPX), Structure for temperature detection in a package.
  73. St.ang.hl Lennart ; Wallace ; Jr. John Francis ; Parraz John Carlenas ; Clark Montford Henry ; Winn David, System and method for separating air flows in a cooling system.
  74. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  75. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  76. Tresh, Michael; Jackson, Brian; Bednarcik, Edward; Prunier, John; Olsen, Martin; Germagian, Mark, Systems and methods for closed loop heat containment with cold aisle isolation for data center cooling.
  77. Fleming, James N.; Goldsberry, Timothy; Shurhay, Mark; Hibner, Max W., Thermal ducting system.
  78. Dodson Douglas A. (5995 Avenida Encinas Carlsbad CA 92008), Twin fan cooling device.
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