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Method for use in the manufacture of semiconductor devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/302
  • H01L-007/34
출원번호 US-0801434 (1977-05-27)
발명자 / 주소
  • Gluck Ronald M. (Rochester NY)
출원인 / 주소
  • Eastman Kodak Company (Rochester NY 02)
인용정보 피인용 횟수 : 35  인용 특허 : 0

초록

A procedure for cleaning a semiconductor material of impurities which reside on the surface of the material is disclosed. The procedure is indicated for use prior to one or more thermal processing steps for the material, and involves the exposure of the material to a cleaning gas comprised of nitric

대표청구항

In a method for the manufacture of a silicon semiconductor device, said method comprising at least one step in which such device is exposed to a high-temperature gaseous environment, the improvement of gettering metallic gold and other impurities from the silicon of said device comprising the step o

이 특허를 인용한 특허 (35)

  1. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Apparatus for rinsing and drying surfaces.
  2. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Apparatus for treating wafers with process fluids.
  3. Benesch, Robert; Haouchine, Malik; Jacksier, Tracey, Articles of manufacture containing increased stability low concentration gases and methods of making and using the same.
  4. Benesch, Robert; Haouchine, Malik; Jacksier, Tracey, Articles of manufacture containing increased stability low concentration gases and methods of making and using the same.
  5. Benesch, Robert; Haouchine, Malik; Jacksier, Tracey, Articles of manufacture containing increased stability low concentration gases and methods of making and using the same.
  6. Restall James E. (Camberley GB2) Hayman Cecil (Rickmansworth GB2), Cleaning of metal articles.
  7. Stoll, Robert W.; MacLaury, Michael R.; Wilson, Ronald H., Enhancing the selectivity of tungsten deposition on conductor and semiconductor surfaces.
  8. Eun,Dong Seog; Lee,Sung Hun, Flash memory and method of fabricating the same.
  9. Gluck Ronald (Rochester NY) Hamblen David P. (Rochester NY), Gaseous cleaning method for silicon devices.
  10. Gluck Ronald (Rochester NY) Roselle Paul L. (Rochester NY), Gaseous cleaning method for silicon devices.
  11. McComas Charles C. (Stuart FL), Gaseous removal of ceramic coatings.
  12. Jacksier, Tracey; Benesch, Robert, Increased stability low concentration gases, products comprising same, and methods of making same.
  13. Chau Robert S. K. ; Brigham Lawrence N. ; Jan Chia-Hong ; Chern Chan-Hong ; Arcot Binny P., Manufacturable dielectric formed using multiple oxidation and anneal steps.
  14. Khosla Rajinder P. ; Hung Liang-Sun, Metal impurity neutralization within semiconductors by fluorination.
  15. Clark R. Scot (Fallbrook CA) Hoffman Joe G. (Oceanside CA) Davison John B. (Mission Viejo CA) Jones Alan W. (San Clemente CA) Jones ; Jr. Allen H. (Carlsbad CA) Persichini David W. (Oceanside CA) Yua, Method and apparatus for the continuous on-site chemical reprocessing of ultrapure liquids.
  16. Bran, Mario E., Method for megasonic processing of an article.
  17. Spacer Edward T. (Harleysville PA), Method for producing high resolution etched circuit patterns from clad laminates.
  18. Bran, Mario E., Method of manufacturing integrated circuit devices.
  19. Alan E. Walter, Methods for treating objects.
  20. Walter Alan E., Methods for treating objects.
  21. Hansen Eric T. ; Becia William Warren ; Ives Thomas Wayne ; Mimken Victor B. ; Hall Randy Mark ; Krawzak Tom, Multiple stage wet processing chamber.
  22. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Process and apparatus for drying surfaces.
  23. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Process and apparatus for treating wafers with process fluids.
  24. Chau, Robert S. K.; Hargrove, William L.; Yau, Leopoldo D., Process for forming a thin oxide layer.
  25. Runge Hartmut (Kirchseeon DEX), Process for gettering semiconductor components and integrated semiconductor circuits.
  26. Gibbons, James F., Process for high temperature surface reactions in semiconductor material.
  27. Jacksier, Tracey; Benesch, Robert; Haouchine, Malik, Reactive gases with concentrations of increased stability and processes for manufacturing same.
  28. Jacksier, Tracey; Benesch, Robert; Haouchine, Malik, Reactive gases with concentrations of increased stability and processes for manufacturing same.
  29. Jacksier,Tracey; Benesch,Robert; Kuhn,John, Reduced moisture compositions comprising an acid gas and a matrix gas, articles of manufacture comprising said compositions, and processes for manufacturing same.
  30. Jacksier,Tracey; Benesch,Robert; Kuhn,John, Reduced moisture compositions comprising an acid gas and a matrix gas, articles of manufacture comprising said compositions, and processes for manufacturing same.
  31. Ramachandran Ravikumar ; Natzle Wesley ; Gutsche Martin ; Akatsu Hiroyuki ; Yu Chien, Removal of post-RIE polymer on Al/Cu metal line.
  32. Reardon,Timothy J.; Oberlitner,Thomas H.; Meuchel,Craig P.; Owczarz,Aleksander; Thompson,Raymon F., Semiconductor processing apparatus.
  33. Bergman Eric J. ; Berner Robert W. ; Oberlitner David, Semiconductor processing using vapor mixtures.
  34. Bran, Mario E., System for megasonic processing of an article.
  35. Elsawy Tamer ; Hall R. Mark ; Butler Josh, Vapor drying system and method.
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