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Interlocking modular building panel with sealing strip 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • E04C-001/14
출원번호 US-0876499 (1978-02-09)
발명자 / 주소
  • Harmon William M. (Worthington OH) Holtzmeier Lindell R. (Athens OH) Yamamoto Toshiaki (Columbus OH)
출원인 / 주소
  • United McGill Corporation (Columbus OH 02)
인용정보 피인용 횟수 : 113  인용 특허 : 1

초록

A modular building panel is provided having interlocking bead and groove conformations formed in mating interfitting tongue and socket structures and provided with sealing strips for forming a fluid seal between adjacent assembled panels. The modular building panel is fabricated with longitudinally

대표청구항

A modular building panel comprising a structurally rigid, elongated panel having opposed, longitudinally extending, marginal edge portions of mating tongue and socket configuration which are each adapted to interfit edgewise with a mating marginal edge portion of an adjacent panel, said opposed marg

이 특허에 인용된 특허 (1)

  1. Anderson John W. (Bradford PA), Double-skin insulated building panel.

이 특허를 인용한 특허 (113)

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