초록 ▼

A semiconductor device package comprises a plurality of walls extending from a base member which has a pellet mounting surface associated therewith. The walls form an enclosure and each one of the walls has a lid receiving surface associated therewith. All of the lid receiving surfaces lie in a sing

A semiconductor device package comprises a plurality of walls extending from a base member which has a pellet mounting surface associated therewith. The walls form an enclosure and each one of the walls has a lid receiving surface associated therewith. All of the lid receiving surfaces lie in a single geometric plane which intersects the geometric plane of the pellet mounting surface at an included angle of less than about 90°. External leads protrude into the enclosures through one of the walls. A lid can be affixed to the lid receiving surfaces to hermetically seal the enclosure. The package is particularly useful when made to conform to the dimensions of the well known TO-220 package.

대표청구항 ▼

A semiconductor device package comprising: a base member having first and second sides and a pellet mounting surface on said first side; hermetic wall means extending from said base member on said first side; a hermetic lid-receiving surface comprising a portion of said wall means; said wall and lid

A semiconductor device package comprising: a base member having first and second sides and a pellet mounting surface on said first side; hermetic wall means extending from said base member on said first side; a hermetic lid-receiving surface comprising a portion of said wall means; said wall and lid-receiving surface together surrounding said pellet mounting surface in such a manner that hermetically sealing a hermetic lid to said lid-receiving surface will enclose said pellet mounting surface in a hermetically sealed container comprising said base member, said wall means and said lid; said lid receiving surface lying in a first geometric plane; said pellet mounting surface lying in a second geometric plane; said first geometric plane and said second geometric plane intersecting at an included angle of less than 90°; at least one electrically conductive lead passing through said wall means and hermetically sealed thereto; a semiconductor device pellet having first and second surfaces and having said first surface thereof affixed to said pellet mounting surface; and said at least one electrically conductive lead connected to said second surface of said semiconductor pellet.