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Method for mounting parts on circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-003/34
출원번호 US-0010026 (1979-02-06)
우선권정보 JP-0012400 (1978-02-08)
발명자 / 주소
  • Nate Kazuo (Machida JPX) Kotsuka Kyoko (Fujisawa JPX) Isogai Tokio (Fujisawa JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 54  인용 특허 : 4

초록 ▼

One or more parts having terminals can be mounted on a circuit board by coating an ultraviolet-curing and thermosetting resin composition comprising an ultraviolet-curing resin, an addition polymerizable monomer, a photosensitizer and a heat polymerization initiator, on the circuit board by screen p

대표청구항 ▼

A method for mounting one or more parts having terminals on a circuit board which comprises coating an ultraviolet-curing and thermosetting resin composition on the circuit board by screen printing with a prescribed pattern except for wiring portions of the circuit board, mounting the parts on the p

이 특허에 인용된 특허 (4)

  1. Shimizu Teruo (Katano JPX) Matsuoka Tetsuo (Neyagawa JPX), Circuit board assembly and method of manufacturing the same.
    상세보기
  2. Berry Robert W. (Bethlehem PA) Feldman David (Allentown PA) Pfahnl Arnold (Allentown PA), Crossover structure for microelectronic circuits.
    상세보기
  3. Green ; George E., Epoxide resins.
    상세보기
  4. Lipson Melvin A. (Fullerton CA) Knoth Dale W. (Norwalk CA) Custer Walter D. (Garden Grove CA) Gilano Michael N. (Fullerton CA), Process for treating selected areas of a surface with solder.
    상세보기

이 특허를 인용한 특허 (54)

  1. Imanishi Makoto,JPX ; Kabeshita Akira,JPX ; Enchi Kohei,JPX ; Shida Satoshi,JPX, Apparatus for mounting an electronic component.
    상세보기
  2. Lake, Rickie C., Battery powerable apparatus, radio frequency communication device, and electric circuit.
    상세보기
  3. Pendse, Rajendra; Ahmad, Nazir; Chen, Andrea; Kim, Kyung-Moon; Kweon, Young Do; Tam, Samuel, Chip scale package with flip chip interconnect.
    상세보기
  4. Yun, Hwang Kyu; Leon, Jeffrey; Peddi, Raj; Kim, YounSang, Coating adhesives onto dicing before grinding and micro-fabricated wafers.
    상세보기
  5. Yun, Hwang Kyu; Leon, Jeffrey; Peddi, Raj; Kim, YounSang, Coating adhesives onto dicing before grinding and micro-fabricated wafers.
    상세보기
  6. Nativi Larry A. (Rocky Hill CT), Conformal coating and potting system.
    상세보기
  7. Nativi Larry A. (Rocky Hill CT), Conformal coating systems.
    상세보기
  8. Nativi, Larry A.; Kadziela, Kris, Conformal coating systems.
    상세보기
  9. Magno, Jr., Joey D., Curing system for sealing an electrical fitting.
    상세보기
  10. Ghosh Prosenjit ; Thomas Sunil, Electro-thermal nested die-attach design.
    상세보기
  11. Ohsawa Mitsuo (Tokyo JPX), Electronic circuit arrangement mounted on printed circuit board.
    상세보기
  12. Tuttle, Mark E., Electronic communication devices, methods of forming electrical communication devices, and communications methods.
    상세보기
  13. Bura Ernst (Bickenbach DEX), Electronic component and adhesive strip combination, and method of attachment of component to a substrate.
    상세보기
  14. Pendse, Rajendra D., Flip chip interconnection structure.
    상세보기
  15. Pendse, Rajendra D., Flip chip interconnection structure.
    상세보기
  16. Pendse,Rajendra D., Flip chip interconnection structure.
    상세보기
  17. Ahmad, Nazir; Kweon, Young-Do; Tam, Samuel; Kim, Kyung-Moon; Pendse, Rajendra D., Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots.
    상세보기
  18. Nishimura, Michiaki, Laminated electronic component and laminated electronic component mounting structure.
    상세보기
  19. Ohsawa Mitsuo (Kanagawa JPX) Noda Yoshiteru (Tokyo JPX) Ichikawa Iwao (Kanagawa JPX) Yamamoto Katsumi (Kanagawa JPX), Method and apparatus for manufacturing hybrid integrated circuits.
    상세보기
  20. Yanai Seiji (Harunamachi JPX) Shirouchi Hideo (Takasaki JPX), Method and apparatus for mounting electronic components in position on circuit boards.
    상세보기
  21. Appelt Bernd K. (Apalachin NY) Schmitt George P. (Vestal NY) Shipley John F. (Endwell NY), Method and composition for applying coatings on printed circuit boards.
    상세보기
  22. Maiwald Werner (Bad Aibling DEX), Method for applying solder to and mounting components on printed circuit boards.
    상세보기
  23. Fujimoto Hiroaki (Hirakata JPX) Hatada Kenzou (Katano JPX) Takeshita Yoshinobu (Kagoshima JPX) Otani Kazuya (Kagoshima JPX) Hidaka Koji (Kushikino JPX) Sakiyama Tsuguo (Kagoshima JPX), Method for attaching semiconductors to a transparent substrate using a light-curable resin.
    상세보기
  24. Imanishi, Makoto; Kabeshita, Akira; Enchi, Kohei; Shida, Satoshi, Method for mounting electronic components and apparatus and dispenser used in the method.
    상세보기
  25. Laviron, Thierry; Leriche, Christian; Fournier, Jean Pierre, Method for producing a portable electronic device with an integrated circuit protected by a photosensitive resin.
    상세보기
  26. Ellrich Klaus (Wrthsee DEX) Gasser Oswald (Seefeld DEX) Guggenberger Rainer (Hechendorf DEX) Wanek Erich (Seefeld DEX), Method for the attachment of components to a circuit board using photoactuatable adhesive.
    상세보기
  27. Ghosh Prosenjit ; Thomas Sunil, Method of attaching a semiconductor microchip to a circuit board.
    상세보기
  28. Lake, Rickie C., Method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit.
    상세보기
  29. Levine Aaron W. (Mercer County NJ), Method of forming a structural bond employing indirect exposure of a light responsive adhesive.
    상세보기
  30. Pendse, Rajendra D., Method of forming flip chip interconnection structure.
    상세보기
  31. Pampalone Thomas R. (Belle Mead NJ) Miller Anthony Z. (Flemington NJ), Method of mounting electronic components.
    상세보기
  32. Karch, Andreas, Placement method for circuit carrier and circuit carrier.
    상세보기
  33. Lynch Daniel M., Polyurethane conformal coating process for a printed wiring board.
    상세보기
  34. Kim, YounSang; Hoang, Gina; Guino, Rose, Pre-cut wafer applied underfill film.
    상세보기
  35. Hoang, Gina; Kim, YounSang; Guino, Rose, Pre-cut wafer applied underfill film on dicing tape.
    상세보기
  36. Tate Howard L. (Newman Lake WA) Romeike Gary L. (Spokane WA) Tara Vinai M. (Spokane WA) Vocture James L. (Spokane WA), Printed circuit board assembly.
    상세보기
  37. Katayama Kaoru,JPX ; Fukuda Hiroshi,JPX ; Kazui Shinichi,JPX ; Ohta Toshihiko,JPX ; Iwata Yasuhiro,JPX ; Shirai Mitsugu,JPX ; Tamura Mitsunori,JPX, Process for manufacturing electronic circuits.
    상세보기
  38. Pendse, Rajendra, Process for precise encapsulation of flip chip interconnects.
    상세보기
  39. Tuttle, John R., Radio frequency identification device and method.
    상세보기
  40. Tuttle, John R., Radio frequency identification device and method.
    상세보기
  41. Kweon, Young-Do; Pendse, Rajendra; Ahmad, Nazir; Kim, Kyung-Moon, Self-coplanarity bumping shape for flip chip.
    상세보기
  42. Kweon,Young Do; Pendse,Rajendra D.; Ahmad,Nazir; Kim,Kyung Moon, Self-coplanarity bumping shape for flip chip.
    상세보기
  43. Kweon,Young Do; Pendse,Rajendra D.; Ahmad,Nazir; Kim,Kyung Moon, Self-coplanarity bumping shape for flip-chip.
    상세보기
  44. Ahmad, Nazir; Kweon, Young-Do; Tam, Samuel; Kim, Kyung-Moon; Pendse, Rajendra D., Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package.
    상세보기
  45. Hwang, Hyun-Ik; Jung, YongJin; Song, Kunho, Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire.
    상세보기
  46. Starnes Roger A. (10230 Belladrum Dr. Alpharetta GA 30201), Serving dish with heating means.
    상세보기
  47. Todd Michael G. (South Lyon MI) Parikh Mayank R. (Canton MI) Santana Jorge D. (Sao Paulo BRX) Ciocler Mauricio (Sao Paulo BRX), Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices.
    상세보기
  48. Bourrieres Francis,FRX, Stencil for depositing and portioning variously thick spot layers of viscous material and method.
    상세보기
  49. Tuttle, John R., System and method to track articles at a point of origin and at a point of destination using RFID.
    상세보기
  50. Mather John C. (Cedar Rapids IA) Young Jerald A. (Cedar Rapids IA), Temporary soldering aid for manufacture of printed wiring assemblies.
    상세보기
  51. Lake Rickie C., Thin profile battery bonding method and method of conductively interconnecting electronic components.
    상세보기
  52. Lake,Rickie C., Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit.
    상세보기
  53. Tomura Yoshihiro (Aichiken JPX) Banno Shigeki (Aichiken JPX), Visible light-curing polyester resin composition.
    상세보기
  54. Gasa, Jeffrey; Phan, Dung Nghi; Leon, Jeffrey; Hajela, Sharad; Kong, Shengqian, Wafer backside coating process with pulsed UV light source.
    상세보기

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