초록 ▼

An improved apparatus for the automatic handling of wafer materials is proposed for the plasma treatment of the wafers such as high-purity silicon semiconductor wafers. In this apparatus, the wafer carried by a carrier means to a position neighboring to a wafer table is picked up by a movable pick-u

An improved apparatus for the automatic handling of wafer materials is proposed for the plasma treatment of the wafers such as high-purity silicon semiconductor wafers. In this apparatus, the wafer carried by a carrier means to a position neighboring to a wafer table is picked up by a movable pick-up means and placed on the wafer table where it is subjected to the plasma treatment after the wafer table is fixed vacuum-tightly to a plasma reaction chamber. After completion of the treatment, the wafer is taken out by a second movable pick-up means and carried away by another carrier means to the succeeding processing step. Thus a possibility of full automatization of wafer processing is provided.

대표청구항 ▼

An apparatus for the treatment of a wafer by plasma reaction which comprises the components of (a) a reaction chamber with an opening in the bottom, (b) a wafer table for mounting a wafer positioned beneath the opening of the reaction chamber and capable of vertical movement relative to the reaction

An apparatus for the treatment of a wafer by plasma reaction which comprises the components of (a) a reaction chamber with an opening in the bottom, (b) a wafer table for mounting a wafer positioned beneath the opening of the reaction chamber and capable of vertical movement relative to the reaction chamber to be fixed vacuum-tightly to the reaction chamber at the uppermost position, (c) an in-take carrier means for carrying the wafer to a neighboring position to the wafer table, (d) an in-take pick-up means for picking up the wafer from the in-take carrier means and placing the same on to the wafer table, (e) a take-out pick-up means for picking up the wafer from the wafer table and bringing the same out from beneath the reaction chamber, (f) a take-out carrier means for receiving the wafer carried by the take-out pick-up means, and (g) a control means for driving the components (a) to (f) in linkage motion.