$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Assembly protecting and inventorying printed circuit boards 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65D-085/00
  • B65D-085/42
출원번호 US-0931866 (1978-08-07)
발명자 / 주소
  • Ohlbach Ralph C. (417 Green Park Ct. Deerfield IL 60015)
인용정보 피인용 횟수 : 84  인용 특허 : 2

초록

A stackable tray or container for assembly of or inventorying or transporting printed circuit board components, constructed of paper board coated on inside surfaces with conductive carbon black particles.

대표청구항

A stack of containers each encompassing at least one printed circuit board contained therein, one container being supported atop an identical container constructed entirely of one-piece paper board, either folding carton board or corrugated board at least of E-flute strength for minimum strength, sa

이 특허에 인용된 특허 (2)

  1. Huffine Coy Lee (Rochester MN) Mattson Larry Frederick (Pine Island MN) Shidler Karl Allen (Rochester MN) Slindee Norman Edward (Austin MN), Anti-static magnetic record disk assembly.
  2. Kisor Thaddeus William (Flemington NJ), Package for semiconductor components.

이 특허를 인용한 특허 (84)

  1. Nienhuis James H. (Wyoming MI) Schreiner Charles P. (Saugatuck MI), Anti-static grounding arrangement for work environment system.
  2. Petcavich Robert J. (2954 Mission Blvd. #4 San Diego CA 92101), Anti-static packages and packaging material.
  3. Burnett Thomas R. (London CAX), Anti-static tray for semi-conductor devices and components.
  4. Hershberger Marc (Rochester NY) Stevens Carl (Rochester NY) Ozug Peter (Rochester NY), Apparatus for shielding an electrical circuit from electromagnetic interference.
  5. Fisher, Michael J.; Long, David C.; Merte, Donald; Weiss, Robert; Weiss, Thomas, Applying pressure to adhesive using CTE mismatch between components.
  6. Lane, Richard J.; Rozek, Kurt L., Circuit board package and method of manufacture.
  7. Brodsky, William L.; Dragone, Silvio; Krabbenhoft, Roger S.; Long, David C.; Oggioni, Stefano S.; Peets, Michael T.; Santiago-Fernandez, William, Circuit boards and electronic packages with embedded tamper-respondent sensor.
  8. Brodsky, William L.; Dragone, Silvio; Krabbenhoft, Roger S.; Long, David C.; Oggioni, Stefano S.; Peets, Michael T.; Santiago-Fernandez, William, Circuit boards and electronic packages with embedded tamper-respondent sensor.
  9. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Isaacs, Phillip Duane, Circuit layouts of tamper-respondent sensors.
  10. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Isaacs, Phillip Duane, Circuit layouts of tamper-respondent sensors.
  11. Wiley Robert E. (Port Huron MI), Conductive cathodic protection compositions and methods.
  12. Wiley Robert E. (Port Huron MI), Conductive coating for elongated conductors.
  13. Wiley Robert E. (Port Huron MI), Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability.
  14. Wiley Robert E. (Port Huron MI), Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatibility.
  15. Ohlbach Ralph C. (Deerefield IL), Conductive container.
  16. Youngs Roger W. (Hinsdale IL) Lewis Robert W. (Saratoga CA) Kussman Robert N. (Tacoma WA) Hurtt John R. (Puyallup WA), Conductive paper and method.
  17. Johansson, Ola M., Consistency determining method and system.
  18. Blodgett Norman S. (Westboro MA), Container for static-sensitive articles.
  19. Young William I. (North Situate MA), Container for static-sensitive articles.
  20. Young William I. (North Situate MA), Container for static-sensitive articles.
  21. Young William I. (North Situate MA), Container for static-sensitive articles.
  22. Yandian,Jeffrey; Graham,Peter G., Container insert.
  23. Fry, Stanley L., Containers with tapered sidewalls and stacking tabs.
  24. Cohen Joel B. (Wynnewood PA), Electrically conductive container.
  25. Isaacs, Phillip D.; Peets, Michael T.; Wei, Xiaojin, Electronic package with heat transfer element(s).
  26. Bradford Judson A. (Holland MI), Electrostatic discharge carton.
  27. Sherwood Robert A. (El Paso TX) Nordberg Svein T. (El Paso TX), Electrostatic discharge-protected switch.
  28. Brodsky, William L.; Dangler, John R.; Dreiss, Zachary T.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s).
  29. Brodsky, William L.; Dangler, John R.; Dreiss, Zachary T.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s).
  30. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  31. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  32. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  33. Ohlbach Ralph C. (417 Green Park Ct. Deerfield IL 60015), For protecting printed circuit boards and other items against the ravages of a discharge of static electricity.
  34. Nagai, Ken; Shimada, Takashi; Nakajima, Yoshiyuki, Hinged carriage case for electronical parts having antistatic properties.
  35. Isaacs, Phillip D.; Peets, Michael T.; Wei, Xiaojin, Manufacturing electronic package with heat transfer element(s).
  36. Gordon, Bertram I., Method and apparatus for assembling, shipping and testing sensitive electronic components.
  37. Tatara Tetsuo,JPX ; Kudo Shigeo,JPX ; Ohtake Yasuhide,JPX, Method of assembling pneumatic tires.
  38. Dangler, John R.; Isaacs, Phillip Duane; Long, David C., Method of fabricating tamper-respondent sensor.
  39. Heitmann,Kjell A; Clark,Douglas A; Perreault,Paul G, Method of making tamper detection circuit for an electronic device.
  40. Johansson Ola M. ; Konkol Dennis L., Monitoring system and method for a fiber processing apparatus.
  41. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  42. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  43. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  44. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  45. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  46. Brodsky, William L.; Dangler, John R.; Isaacs, Phillip Duane; Long, David C.; Peets, Michael T., Overlapping, discrete tamper-respondent sensors.
  47. Cohen Philip S. (Cincinnati OH) Schnittger ; Jr. Robert E. (West Chester OH), Packaging material and container having interlaminate electrostatic shield and method of making same.
  48. Neal Robert (Sebattus ME) Ray Robert (Auburn ME), Printed antistatic plastic bag.
  49. DeHeras Charles (1605 Oak Grove San Marino CA 91008) DeHeras Sheryll (1605 Oak Grove San Marino CA 91008), Printed circuit board transporter.
  50. Armington Steven E. (Kirtland OH) Halperin Stephen A. (Elmhurst IL) Pickett Gordon E. (Reynoldsburg OH) Metz Barbara A. (Baltimore OH), Processes for the production of antistatic or static dissipative paper, and the paper products thus produced, and appara.
  51. Howell George L. (Elmira NY) Lambrix Gregg F. (Elmira NY), Protective packaging container for electrostatic discharge sensitive devices.
  52. Johansson, Ola M., Refiner control method and system.
  53. Johansson, Ola M., Refiner control method and system.
  54. Johansson, Ola M.; Wulf, Timothy L., Refiner disk sensor and sensor refiner disk.
  55. Lutz,Mark S., Refiner sensor and coupling arrangement.
  56. Ray Robert (R.F.D. 1 ; Wales Rd. Auburn ME) Neal Robert A. (R.F.D. 1 ; Wales Rd. Sabattus ME 04280) Jaran John R. (Waterbury CT) Parker Tim (Southbury CT), Static dissipative elastomeric coating for electronic packaging components.
  57. Kazor Thomas R. (Chandler AZ) Whitcomb Jon P. (Phoenix AZ), Static shielded shipping container.
  58. Ridgeway Devin C., Suspension and retention packaging structures and methods for forming same.
  59. Clark,Douglas A; Heitmann,Kjell A; Perreault,Paul G, Tamper barrier enclosure with corner protection.
  60. Heitmann,Kjell A; Clark,Douglas A; Perreault,Paul G, Tamper barrier for electronic device.
  61. Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
  62. Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
  63. Busby, James A.; Dragone, Silvio; Gaynes, Michael A.; Rodbell, Kenneth P.; Santiago-Fernandez, William, Tamper-proof electronic packages with stressed glass component substrate(s).
  64. Busby, James A.; Dragone, Silvio; Gaynes, Michael A.; Rodbell, Kenneth P.; Santiago-Fernandez, William, Tamper-proof electronic packages with stressed glass component substrate(s).
  65. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J., Tamper-proof electronic packages with two-phase dielectric fluid.
  66. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J., Tamper-proof electronic packages with two-phase dielectric fluid.
  67. Brodsky, William L.; Busby, James A.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent assemblies.
  68. Brodsky, William L.; Busby, James A.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent assemblies.
  69. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  70. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  71. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  72. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  73. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  74. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  75. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  76. Dangler, John R.; Long, David C.; Peets, Michael T., Tamper-respondent assemblies with region(s) of increased susceptibility to damage.
  77. Busby, James A.; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Weiss, Thomas, Tamper-respondent assemblies with trace regions of increased susceptibility to breaking.
  78. Busby, James A.; Isaacs, Phillip Duane, Tamper-respondent assembly with nonlinearity monitoring.
  79. Busby, James A.; Isaacs, Phillip Duane, Tamper-respondent assembly with nonlinearity monitoring.
  80. Isaacs, Phillip Duane, Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s).
  81. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
  82. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
  83. Dangler, John R.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent sensors with formed flexible layer(s).
  84. Kreeger, Elsmer W., Three-level stack and nest container.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로