초록 ▼

This invention relates to a process for improving heat insulating articles containing silicon dioxide having a surface area of at least 50 m2/g, opacifiers and, if desired, inorganic fibers which comprises treating the surface of the insulating articles with at least one organosilicon compound conta

This invention relates to a process for improving heat insulating articles containing silicon dioxide having a surface area of at least 50 m2/g, opacifiers and, if desired, inorganic fibers which comprises treating the surface of the insulating articles with at least one organosilicon compound containing from 1 to 4 silicon atoms to render the same hydrophobic.

대표청구항 ▼

A process for improving heat insulating elements which are prepared via a dry process from silicon dioxide having a surface area of at least 50 m2/g and opacifiers which comprises treating the surface of the heat insulating elements with at least 1 organosilicon compound containing from 1 to 4 silic

A process for improving heat insulating elements which are prepared via a dry process from silicon dioxide having a surface area of at least 50 m2/g and opacifiers which comprises treating the surface of the heat insulating elements with at least 1 organosilicon compound containing from 1 to 4 silicon atoms selected from the group consisting of hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane and silicon compounds of the formulas (R3Si)aZ and Ra SiZ′4-a′ in which R is selected from the group consisting of monovalent hydrocarbon radicals and halogenated monovalent hydrocarbon radicals, Z is selected from the group consisting of hydrogen, halogen, OH, －OR′, －NR′X, －ONR′2, －SR′, －OOCR′, －O－, －NX and －S－, Z′is selected from the group consisting of hydrogen, halogen, －OH, －OR′, －NR′X, －ONR′2, －SR′and －OOCR′, R′is a radical having from 1 to 4 carbon atoms, X is selected from the groups consisting of hydrogen and R′and a is 1 or 2, and thereafter removing the excess organosilicon compound employed in the treatment of the elements.