초록 ▼

A non-destructive bond testing apparatus utilizes impedance variation represented by both the phase and amplitude of the signal vector response of a sonic energy generating and receiving probe, which is applied to a laminar, honeycomb or fiber composite structure under test. Typical bonding methods

A non-destructive bond testing apparatus utilizes impedance variation represented by both the phase and amplitude of the signal vector response of a sonic energy generating and receiving probe, which is applied to a laminar, honeycomb or fiber composite structure under test. Typical bonding methods for which this bondtester and method are applicable include adhesive bonding, diffusion bonding, brazing, resistance and impact/friction bonding. A cathode ray tube displays the tip of the vector (as a bright dot) which represents the impedance characteristic affected by the structure under test. A null circuit deletes the response of a non-flawed (or normal) portion of the structure under test so that a flawed (or abnormal) portion of the structure produces an impedance variation from the null point, the variation being represented on a polar coordinate display by the amplitude and angular position of the vector tip, thereby providing diagnostic information regarding the location and type of the bondline condition being detected. Bondline conditions/flaws detectable include, disbonds, adhesive thickness, adhesive porosity, degree of adhesive cure, adhesive (cohesive) strength and forms of in-service adhesive or bondline degradation.

대표청구항 ▼

An improved apparatus for non-destructively detecting and diagnosing flaws and other bondline conditions between the bonded layers of multilayered bonded structures, the apparatus having a sonic energy transceiver probe for physical contact with a surface of the structure, the complex impedance of t

An improved apparatus for non-destructively detecting and diagnosing flaws and other bondline conditions between the bonded layers of multilayered bonded structures, the apparatus having a sonic energy transceiver probe for physical contact with a surface of the structure, the complex impedance of the probe being indicative of the location of a detected bond flaw, the apparatus also having a source for generating a steady state sonic energy signal of known frequency, the signal being input to the probe, the phase and amplitude of the output signal of the probe being indicative of the complex impedance of the probe; the improvement comprising: means for processing a probe output signal to produce component signals representative of the relative phase and amplitude of said probe output signal, and means for displaying said component signals to produce a visual indication of the relative phase and amplitude of the said probe output signal whereby the location of the detected bond flaw is determined.