초록 ▼

A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit

A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit (IC) chips with a high density (i.e. 100 or more) input/output I/O terminal array on the bottom surface of each chip bonded to a corresponding registerable array of PC conductor pads of the polyimide member. The forming, curing and circuitizing of the polyimide member, the bonding of the I/O terminals to the pads of the PC member, and the bonding of the pin heads to the PC member are done on a temporary support or fixture. The method provides a reliable manner for fabrication of the package assembly which minimizes the risk of destroying the flexibility of the PC member and/or its integrity during the making of the assembly and/or the subsequent thermal cycling associated with the assembly.

대표청구항 ▼

The method for making at least one electronic package assembly, said assembly having at least an insulator pin carrier member, plural conductive elongated pluggable pins carried by said member, each of said pins being extended through said member to provide first and second extensions past first and

The method for making at least one electronic package assembly, said assembly having at least an insulator pin carrier member, plural conductive elongated pluggable pins carried by said member, each of said pins being extended through said member to provide first and second extensions past first and second surfaces, respectively, of said member, a thin flexible printed circuit conductive member having a polyimide substrate of a predetermined thickness of substantially 5 microns, a printed circuit pattern of plural conductors supported by said substrate, said first extensions being bonded to predetermined ones of said plural conductors, and at least one electronic circuit chip having input/output terminals bonded to preselected ones of said plural conductors, said method comprising the steps of: providing temporary planar support means, forming an integral layer of uncured liquid polyimide on one surface of said support means sufficient to provide said predetermined thickness when said polyimide is subsequently cured, curing said polyimide layer, circuitizing the outer surface of said cured polyimide layer with said plural conductors of said predetermined circuit pattern, providing said insulator pin carrier member and said plural pins carried thereby, providing said electronic circuit chip, bonding said terminals of said chip to said preselected ones of said conductors, selectably removing portions of said temporary support means from said polyimide layer, forming holes in said polyimide layer to said predetermined ones of said conductors, inserting said first extensions of said pins through said holes, and bonding said first extensions of said pins of said pin carrier member to said predetermined ones of said conductors.