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Method of preparing substrate surface for electroless plating and products produced thereby

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-003/02
출원번호 US-0005169 (1979-01-22)
발명자 / 주소
  • Mallory
  • Jr. Glenn O. (Los Angeles CA)
출원인 / 주소
  • Richardson Chemical Company (Des Plaines IL 02)
인용정보 피인용 횟수 : 167  인용 특허 : 6

초록

Polyalloy catalytic coating formulations are used for preparing a metallic substrate surface to enhance subsequent plating thereover of nickel, cobalt or polyalloys including nickel or cobalt. At the same time, these catalytic formulations can be rinsed subsequent to their application onto the subst

대표청구항

A method for preparing a printed wiring board which comprises treating a wiring board having a circuitry pattern thereon with a polymetallic catalyzing agent bath including a deposition-enhancing metal selected from the group consisting of nickel, cobalt, and combinations thereof, and a secondary me

이 특허에 인용된 특허 (6)

  1. Grunwald John J. (Waterbury CT) Kukanskis Peter E. (Naugatuck CT) Jacovich Elaine F. (Cheshire CT) D\Ottavio Eugene D. (Waterbury CT), Additive printed circuit boards and method of manufacture.
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  5. Feldstein Nathan (Princeton NJ), Non-precious metal colloidal dispersions for electroless metal deposition.
  6. Steffen Horst (Geldern DT), Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization.

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