초록 ▼

A heat-recoverable wrap-around device made from heat-shrinkable sheet material is provided with mechanical retaining means which co-operate with opposed edge regions of the sheet material so that after recovery about a substrate such as an electrical cable, the device lies substantially flush with t

A heat-recoverable wrap-around device made from heat-shrinkable sheet material is provided with mechanical retaining means which co-operate with opposed edge regions of the sheet material so that after recovery about a substrate such as an electrical cable, the device lies substantially flush with the substrate without protuberances. The mechanical retaining means is preferably a buckle which is shaped to conform with the substrate and in which the sheet material is held by frictional forces.

대표청구항 ▼

A wrap-around device which comprises heat recoverable sheet material and mechanical retaining means adapted to cooperate and engage opposed edge regions of the sheet material so that the surface of the device after recovery about a substrate lies substantially flush with the substrate without protub

A wrap-around device which comprises heat recoverable sheet material and mechanical retaining means adapted to cooperate and engage opposed edge regions of the sheet material so that the surface of the device after recovery about a substrate lies substantially flush with the substrate without protuberances from its outer surface, the mechanical retaining means being provided with means for receiving and engaging an electrical component to electrically connect the component to the substrate. A method of forming a wrap-around connection to a substrate comprising wrapping a length of heat recoverable sheet material about the substrate, engaging opposed edge regions of said sheet material with mechanical retaining means, said mechanical retaining means being provided with receiving means for an electrical component, positioning an electrical component in said receiving means, and heating said sheet material to cause recovery and electrically connect said electrical component to said substrate.