$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatus for treatment with gas plasma 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G02B-005/14
출원번호 US-0919856 (1978-06-28)
우선권정보 JP-0114977 (1977-09-24)
발명자 / 주소
  • Uehara Akira (Yokohama JPX) Kiyota Hiroyuki (Hiratsuka JPX) Nakane Hisashi (Kawasaki JPX) Toda Shozo (Fujisawa JPX)
출원인 / 주소
  • Tokyo Ohka Kogyo Kabushiki Kaisha (Kawasaki JPX 03)
인용정보 피인용 횟수 : 37  인용 특허 : 3

초록

An improved apparatus for plasma treatment of silicon semiconductor wafers is proposed in which the end point of the plasma etching or ashing can be readily detected by monitoring with an optical fiberscope penetrating the wall of the plasma reaction chamber with one terminal located inside the plas

대표청구항

Plasma treatment apparatus for treatment of silicon semiconductor wafers and the like comprising a plasma reaction chamber having an inlet for plasma forming gas and an outlet for connection to a vacuum source, means for supporting a semiconductor wafer during plasma treatment and comprising, a wafe

이 특허에 인용된 특허 (3)

  1. Feuerstein Roger F. (Schenectady NY) Freeman Maurice A. (Burnt Hills NY) Spinelli Leonardo B. (Albany NY), Borescope support apparatus.
  2. Hansel ; William B. ; O'Connell ; Paul B., Fiber optic liquid level sensor.
  3. Magee Robert J. (Concord MA) Murphy Bernard J. (Westford MA), Optical viewing system for high pressure environments.

이 특허를 인용한 특허 (37)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Tan, Tai Ho; Williams, Arthur H., Apparatus for recording emissions from a rapidly generated plasma from a single plasma producing event.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  5. Blackburn Greg (San Jose CA) Kava Joseph (San Jose CA) McGovern Richard (San Jose CA) Rozenzon Yan (San Jose CA), Contaminant reduction improvements for plasma etch chambers.
  6. Blackburn Greg ; Kava Joseph ; McGovern Richard ; Rozenzon Yan, Contaminant reduction improvements for plasma etch chambers.
  7. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  8. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  9. Jones, William D., High pressure fourier transform infrared cell.
  10. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  11. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  12. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  13. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  14. Brearley William Harrington (Poughkeepsie NY) Forslund Donald Charles (Wappingers Falls NY) Ormond ; Jr. Douglas William (Wappingers Falls NY) Sliss Gerald Joseph (Poughkeepsie NY), Ion milling end point detection method and apparatus.
  15. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  16. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  17. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  18. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  19. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  20. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  21. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  22. Curtis Bernard J. (Gattikon CHX), Method for end point detection in a plasma etching process.
  23. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  24. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  25. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  26. Ni,Tuqiang; Collison,Wenli, Methods for detecting the endpoint of a photoresist stripping process.
  27. Fujimura Shuzo,JPX ; Kisa Toshimasa,JPX ; Motoki Yasunari,JPX, Microwave plasma processing process and apparatus.
  28. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  29. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  30. Wuester,Christopher D., Process flow thermocouple.
  31. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  32. Beginski, David A., Sensor signal transmission from processing system.
  33. Heiko D Moritz ; Jonathan A. Talbott ; Mohan Chandra ; James A. Tseronis ; Ijaz Jafri, Supercritical fluid drying system and method of use.
  34. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  35. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  36. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  37. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로