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A method which utilizes thermo-compression diffusion bonding to attach a metal foil to structured copper. The different rate of expansion of metal press members with temperature creates a force which squeezes the foil and copper together to achieve a bond when the press and the parts to be joined ar

A method which utilizes thermo-compression diffusion bonding to attach a metal foil to structured copper. The different rate of expansion of metal press members with temperature creates a force which squeezes the foil and copper together to achieve a bond when the press and the parts to be joined are heated to an elevated temperature. Because of the high pressure achieved by the press, diffusion bonding occurs at a low enough temperature to avoid problems associated with use of the liquid phase of any of the metals undergoing bonding.

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A method of thermo-compression diffusion bonding metallic foil to a structured copper strain relief disk, said disk comprising straight filamentary strands of oxide-coated copper arranged in parallel fashion and closely packed together, said method comprising: positioning the disk and metallic foil

A method of thermo-compression diffusion bonding metallic foil to a structured copper strain relief disk, said disk comprising straight filamentary strands of oxide-coated copper arranged in parallel fashion and closely packed together, said method comprising: positioning the disk and metallic foil in substantial abutment with each other; surrounding said disk and said metallic foil with an inert atmosphere; applying a loading force to squeeze together at high pressure, said disk and said metallic foil; and heating said disk and said metallic foil at a temperature within the range of 300°C. to 400°C. while said disk and said metallic foil are being squeezed together.