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Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-003/02
출원번호 US-0964128 (1978-11-27)
발명자 / 주소
  • Goldstein Rachel (Givataim CT ILX) Kukanskis Peter E. (Watertown CT) Grunwald John J. (New Haven CT)
출원인 / 주소
  • MacDermid Incorporated (Waterbury CT 02)
인용정보 피인용 횟수 : 182  인용 특허 : 4

초록

Electroless copper deposition solutions, and method of continuously electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to mai

대표청구항

In a composition for the electroless deposition of copper including, in an essentially alkaline aqueous solution, a soluble source of cupric ions, a complexing agent to maintain the cupric ions in solution and a reducing agent capable of providing a soluble source of hypophosphite ions effective to

이 특허에 인용된 특허 (4)

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  4. Feldstein ; Nathan, Method of preparation and use of electroless plating catalysts.

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