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A semiconductor device in which a conducting shielding member is disposed over the space between the input and output terminal metal layers and over the semiconductor chip bonded to the output metal layer. The shielding member is electrically connected to the common terminal metal layer. This constr

A semiconductor device in which a conducting shielding member is disposed over the space between the input and output terminal metal layers and over the semiconductor chip bonded to the output metal layer. The shielding member is electrically connected to the common terminal metal layer. This construction results in a reduction in the storage capacitance between the input and output terminal layers and improved power gain and stability of operation, particularly at high frequencies.

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A semiconductor device comprising: an insulator substrate having a major surface; first, second and third metal layers disposed on said major surface of said insulator substrate and mutually separated from each other, said first metal layer serving as an input terminal, said second metal layer servi

A semiconductor device comprising: an insulator substrate having a major surface; first, second and third metal layers disposed on said major surface of said insulator substrate and mutually separated from each other, said first metal layer serving as an input terminal, said second metal layer serving as an output terminal, and said third metal layer serving as a common terminal; a semiconductor chip having a bottom surface and an upper surface and bonded at said bottom surface on said second metal layer, the upper surface of said semiconductor chip including an input electrode and a common electrode. a first bonding wire connected at one end to said first metal layer and at its other end to said input electrode of said semiconductor chip; a second bonding wire connected at one end to said third metal layer and at its other end to said common electrode of said semiconductor chip; a piece of conductive metal covering said first and second bonding wires, said semiconductor chip, and the smallest space between said first and second metal layers; a supporting member mechanically supporting said piece of conductive metal in a manner such that said piece of conductive metal is spaced from said bonding wires and from said semiconductor chip; means for supplying a fixed potential to said piece of conductive metal; and a molded resin enclosing said piece of conductive metal, said semiconductor chip, and said bonding wires and attached to said piece of conductive metal and to at least a portion of said major surface of said insulator substrate. *** BRS DOCUMENT BOUNDARY ***