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Method of ultrasonic control for lapping and an apparatus therefor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/04
출원번호 US-0116396 (1980-01-29)
우선권정보 JP-0010024 (1979-01-31)
발명자 / 주소
  • Masuko Masami (Tokyo JPX) Ichikawa Chikanobu (Koshoku JPX)
출원인 / 주소
  • Fujikoshi Machinery Corporation (Nagano JPX 03)
인용정보 피인용 횟수 : 51  인용 특허 : 4

초록

A novel method and apparatus are provided by the invention for the precision-control of the thickness of thin work pieces under lapping in a lapping machine having an upper and lower lapping surface plates rotatable relative to each other sandwiching the work pieces with continuous supply of a lappi

대표청구항

A method for lapping a thin work piece in a lapping machine having a lower lapping surface plate with an annular lapping surface and an upper lapping surface plate with an annular lapping surface rotating relative to and substantially in parallel with the lower lapping surface plate with said work p

이 특허에 인용된 특허 (4)

  1. Sauerland Franz L. (2851 Southington Rd. Shaker Heights OH 44120), Apparatus for automatic lapping control.
  2. Roddy ; Patrick ; Downes ; George W. ; Searle ; John V. ; Bregazzi ; Ter ence W., Method and apparatus for nondestructive ultrasonic measuring of cast engine cylinder wall thickness.
  3. Niklas Ludwig (Lovenich CT DT) Walker Philip A. (Trumbull CT), Ultrasonic pulse-echo thickness and velocity measuring apparatus.
  4. Walker ; Philip A., Ultrasonic velocity measuring method and apparatus.

이 특허를 인용한 특허 (51)

  1. Merrill Daniel L. ; Synder John R. ; Eckholm ; Jr. Chuck O. ; Sunday Steve M. ; Seaver John L., Abrasive machining assembly.
  2. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  3. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  4. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  5. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
  6. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
  7. Shindou Hiroshi,JPX ; Abe Tetsuo,JPX ; Ogawa Akio,JPX ; Hasebe Tsugihiro,JPX, Apparatus and method for lapping magnetic heads.
  8. Eastman ; Jr. Arnold B. ; Shepherd Michael W., Apparatus for cleaning the grooves of lapping plates.
  9. Tang, Wallace T. Y., Apparatus for detection of thin films during chemical/mechanical polishing planarization.
  10. Kaoyashi Michihiko ; Sauerland Franz L., Automatic lapping control.
  11. Obeng,Yaw S.; Thomas,Peter A.; Kelly,Patrick J., Compacted polishing pads for improved chemical mechanical polishing longevity.
  12. Onishi, Susumu; Maruta, Masashi, Double-side polishing apparatus.
  13. Moon, Won-Jae; Na, Sang-Oeb; Oh, Hyung-Young; Kim, Yang-Han; Kim, Young-Sik; Kim, Kil-Ho; Park, Heui-Joon; Lee, Chang-Hee, Glass polishing system.
  14. Moon, Won-Jae; Na, Sang-Oeb; Oh, Hyung-Young; Kim, Yang-Han; Kim, Young-Sik; Kim, Kil-Ho; Park, Heui-Joon; Lee, Chang-Hee, Glass polishing system.
  15. Saitoh,Akiyoshi, Grinding method for vertical type of double disk surface grinding machine.
  16. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
  17. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
  18. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
  19. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
  20. Kitajima Kenkichi,JPX ; Kubota Kazuo,JPX, Lapping method using upper and lower lapping turntables.
  21. Obeng, Yaw S., Measuring the surface properties of polishing pads using ultrasonic reflectance.
  22. Tandon Sham ; Tandon Suman ; Seshan Ram, Method and apparatus for polishing a hard disk substrate.
  23. Herb, John D.; Teeny, Ned W.; Schultz, Stephen C., Method and apparatus for sensing a wafer in a carrier.
  24. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
  25. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
  26. Katagiri Kiyoo (Niigata JPX) Honda Mitsuo (Niigata JPX), Method for controlling thickness of wafer-like work pieces under lapping and a lapping machine therefor.
  27. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Method for in-situ endpoint detection for chemical mechanical polishing operations.
  28. Kanzow, Jörn; Jessen, Sebastian; Gurgel, Eckehard; Grotkopp, Ingo, Method for machining flat workpieces.
  29. Hajime Hirofumi,JPX ; Yubitani Toshiharu,JPX, Method for polishing the top and bottom of a semiconductor wafer simultaneously.
  30. Eastman, Jr., Arnold B.; Shepherd, Michael W.; Wells, Jack R., Method for supplying slurry to a semiconductor processing machine.
  31. Boggs Karl E. ; Davis Kenneth M. ; Landers William F. ; Lofaro Michael F. ; Ticknor Adam D. ; Fiege Ronald D., Piezo-actuated CMP carrier.
  32. Sakata, Keisuke, Polishing apparatus.
  33. Anderson ; III Robert L. ; Hose John, Polishing apparatus with improved alignment of polishing plates.
  34. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
  35. Mattingly Wayne (Canyon Country CA) Arai Hatsuyuki (Zama JPX), Polishing control method.
  36. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.
  37. Norio Kimura JP; Hirokuni Hiyama JP; Yutaka Wada JP; Kiyotaka Kawashima JP; Manabu Tsujimura JP; Takayoshi Kawamoto JP, Polishing solution feeder.
  38. Omiya Junji,JPX ; Wada Masato,JPX, Rotary joint for fluid.
  39. Kahn Stephen S., Slurry delivery system for a metal polisher.
  40. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  41. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  42. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  43. Eastman ; Jr. Arnold B. ; Shepherd Michael W. ; Wells Jack R., System and method for supplying slurry to a semiconductor processing machine.
  44. Nagayama,Hitoshi; Inoue,Yusuke, Thickness control method and double side polisher.
  45. Nagayama,Hitoshi; Inoue,Yusuke, Thickness control method and double side polisher.
  46. Meloni Mark A., Ultrasonic methods and apparatus for the in-situ detection of workpiece loss.
  47. James Sinclair ; Lawrence L. Lee, Wafer carrier for chemical mechanical planarization polishing.
  48. Sinclair James ; Lee Lawrence L., Wafer carrier for chemical mechanical planarization polishing.
  49. Park, Woo Shik, Wafer polishing apparatus and wafer polishing method using same.
  50. Takaishi, Kazushige; Takanashi, Keiichi; Taniguchi, Tetsurou; Ogata, Shinichi; Mikuriya, Shunsuke, Wafer polishing method.
  51. Cesna Joseph V., Wafer polishing with improved end point detection.
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