초록 ▼

A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder

A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder is displaced by the circuit board to produce a buoyant force which presses the circuit board against the contact member. The speed of the contact member in moving through the molten solder is controlled to determine dwell time of the circuit board and maintain contact between the circuit board and the contact member. An apparatus for continuously applying a solder coating to copper-coated holes and tracks on a printed circuit board. The apparatus includes means to contain a bath of molten solder and means to contact the upper surface of a printed circuit board. Also, the apparatus includes means to move the contacted circuit board through the bath of molten solder as the displaced solder exerts an upward buoyant force against the circuit board.

대표청구항 ▼

A continuous process for coating copper circuit tracks on a printed circuit board with solder to protect the copper track from oxidation and to facilitate subsequent soldering operations in which components are mounted on the circuit board, comprising: contacting a surface of a printed circuit board

A continuous process for coating copper circuit tracks on a printed circuit board with solder to protect the copper track from oxidation and to facilitate subsequent soldering operations in which components are mounted on the circuit board, comprising: contacting a surface of a printed circuit board having a flux on the copper circuit tracks by a contact member positioned above the board so that one surface of the board is in facing contact with said contact member; moving the contact member and the printed circuit board in contact therewith into a molten bath of solder; displacing solder with the circuit board to produce a buoyant force pressing the board against the contact member while the board remains immersed in the molten solder so that the molten solder contacts each surface of the board; and moving the contact member through the molten bath at a speed which maintains contact between the circuit board and the contact member, whereby the circuit board is immersed in the molten bath and is buoyantly supported by the molten bath as the circuit board is moved through the bath by the contact member.