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A photopolymerisable composition particularly useful as a solder resist composition able to withstand molten solder without loss of adhesion, pitmarks or shrinkage and for forming durable coatings on substrates generally is obtained by a combination of a photoinitiator, a polythiol acting as a chain

A photopolymerisable composition particularly useful as a solder resist composition able to withstand molten solder without loss of adhesion, pitmarks or shrinkage and for forming durable coatings on substrates generally is obtained by a combination of a photoinitiator, a polythiol acting as a chain modifier, and a polymer having hydroxy terminated chains capped by acrylate groups connected to the chains via the residue of a polyisocyanate.

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A process for soldering electrical components on a circuit board which comprises protecting areas of the board by applying thereto a photopolymerisable liquid composition which on curing forms a solder resist and which comprises a polymerisable component which is a polymer having an average of at le

A process for soldering electrical components on a circuit board which comprises protecting areas of the board by applying thereto a photopolymerisable liquid composition which on curing forms a solder resist and which comprises a polymerisable component which is a polymer having an average of at least two terminal groups per molecule, which groups provide ethylenic double bonds by which the polymer may be further polymerised and which groups are attached to the remainder of the polymer molecule by groups of the formula: [Figure] which are the residues of a polyisocyanate, a polythiol as a chain modifier, and a photoinitiator capable of initiating polymerisation of the polymerisable component upon UV-irradiation, curing the composition to form the solder resist and soldering electrical components to the protected areas of the board.